Build-to-Specification

Automatic DIE Placement Directly from Wafer

Assembly Support Capabilities

  • Automated Surface-Mount Technology (SMT) Line
    • Mydata 100SXe - BGA, LGA, 01005
    • Heller 1913 MKIII - 13 zone furnace
  • COB Technology (Chip on Board)
  • Mixed Technology (SMT/Chip & Wire)
  • Multi Wafer Die Pick (film frame to 8")
  • Mechanical Integration (Cover and Housing Prep)
  • Hand Soldering
  • Eutectic Soldering
  • Screen Printing
  • Encapsulation
  • Feed-thru Installation
  • Thermo-sonic Tacking/Gap Welding
  • Bond Pull
  • Die Shear
  • Laser Marking
  • Plasma Cleaning
  • Substrate Dicing
  • Vapor Degreasing
  • Inspection
  • Open Package Leak Testing

Certifications

  • ISO 9001:2008 Certified
  • ITAR Registered
  • IPC-A-610, J-STD 001, MIL-STD 883 Certified Manufacturing and Inspection Personnel

Build-to-Specification Capabilities

Build-to-Specification Turnkey Assembly Capabilities

Build-to-Specification Assembly Capabilities

Build & Test Services
MACOM provides the best in class, build-to-specification turnkey & consignment assembly and test capabilities for the defense, medical, optoelectronics, and commercial electronics industries. Servicing customers who are looking for quick turnaround for small, mid-size to high production runs, our dedicated production and testing cells are here to facilitate and meet your exact product requirements, with the overall goal of reducing time-to-market, and being cost effective.

MACOM offers a full line of build-to-specification assembly and test services in a state of the art facility. Our dedicated team of certified assemblers and skilled operators are experts in the RF/Microwave field, and have all of the necessary tools to support your project. MACOM provides close technical support from program’s inception to final integration, through product development and design, and our steadfast commitment to on-time delivery.

Full Turnkey/Consignment Solutions
MACOM’s expertly staffed design and manufacturing team is capable of fulfilling all of your contract manufacturing services. We have the expertise to move from the traditional assembly and test of customer supplied materials, to that of a turnkey or consignment order, including material procurements, with complete quality control that is documented from inception to end.

As an approved outsourcing partner to major defense contractors, MACOM has delivered thousands of complex multifunction microwave assemblies that perform in the most demanding mission-critical environments. In addition to our precision assembly, MACOM provides a wide range of environmental and mechanical testing, complementing our assembly capabilities.  A main supplier of complex, high-frequency subsystems, MACOM is uniquely qualified and flexible in handling your most complicated projects.

Key Advantages

  • Complete consignment and turnkey options
  • Provide full compliance to customer specification control documents
  • Provide manufacturing to companies during spike demand situations
  • Approved Vendor for A&D Prime Contractors
  • Automated SMT Line
  • Automated Chip & Wire
  • Mixed Technology (SMT/Chip & Wire)
  • Automated Microelectronics and Microwave Assembly
  • Facility 14,000 sq. ft. (3,500 sq. ft. class 10,000 clean room)
  • Automated microelectronics and microwave assembly
    • Turnkey reduction in supplier management
    • Utilization of MACOM's operations management
    • Cost savings and high yields
    • Cycle time and turnaround
    • Process Development
    • 100% Inspection Service

Contact

For more information about our build-to-specification assembly capabilities:  Email Inquiry

Key Markets

  • Aerospace & Defense
  • Medical and Commercial Electronics
  • RF and High Frequency
  • Optoelectronics

Production Test

  • Network Integrated Test Environment
    • 60 Automated systems worldwide
    • Full data capture and analysis (Separate server for ITAR products)
  • Capabilities
    • DC, RF and optical
    • Up to 50 GHz
    • Up to 20 watts (higher power performed in the engineering lab)
  • Electronic Wafer Mapping
  • Custom Robotic Handlers
  • Custom Rack & Stack Test Stands

Packages

  • Chip on flex
  • SMT assembly
  • Chip on board
  • Multi-chip modules
  • Connectorized RF module
  • System on chip