Tyco Electronics'
M/A-COM business is a vertically integrated company with a
broad design and manufacturing technology base that supports
Si, GaAs and glass material fabrication. Having our own FAB
enhances our ability to design and manufacture a wide range
of RF and Microwave components. Building on this base we have
the flexibility to develop advanced integrated assemblies and
sub-systems that incorporate the latest component technology.
Our sub system designers have an exceptional ability to look
at the total subsystem requirement and then, through close
cooperation with M/A-COM component designers allocate the various
performance requirements between the multiple functions so
as to achieve the best cost to performance balance. The internal
availability of components also minimizes cycle time when unique
performance requirements are necessary.
To further reduce cycle time and achieve first pass success,
the M/A-COM design staff is equipped with the latest tools
to model complex assemblies and subsystems using, both traditional
technologies and M/A-COM proprietary integration mediums,
GMIC and HMIC. These proprietary technologies allow the integration
of passive and active devices on glass have been proven in
production over the past 20 years. Close cooperation between
the engineering staff designing integrated assemblies and
corporate R&D continuously improves our integration
technology.
Lower cost, smaller size, reduced weight, improved performance
and improved reliability are just some of the benefit we
can offer. We strive to work closely with our customers
to maximize the potential benefit of integration. We put a
high priority on understanding our customers needs and excelling
to meet those needs. As a half billion dollar company with
the backing of our 13 billion dollar plus parent company Tyco
Electronics, the M/A-COM business has the resources it takes
to make complex programs succeed.
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