We
manufacture and stock a wide variety of leaded and surface
mount packages for RF and microwave diodes. Hermetic and non-hermetic
designs are created through a high temperature ceramic to metal
seal brazing process. Diode housings are available with Kovar,
TeCu or Copper base materials. Leaded packages are available
in 2x2 inch arrays for automated die attach, wire bond and
sealing applications. We also offer packages for discrete photodiodes,
VCSELs and high brightness LEDs.
We
manufacture and stock a wide variety of leaded and surface
mount packages for RF and microwave diodes. Hermetic and non-hermetic
designs are created through a high temperature ceramic to metal
seal brazing process. Diode housings are available with Kovar,
TeCu or Copper base materials. Leaded packages are available
in 2x2 inch arrays for automated die attach, wire bond and
sealing applications. We also offer packages for discrete photodiodes,
VCSELs and high brightness LEDs. 