Substrates

Alumina, BeO and AlN metallized substrates are available in a host of configurations with tungsten thick film metallization. The patterned tungsten metallization can be electrolytically plated with Ni, Sn, Cu, Ag and Au. Substrates can also be electroless plated with Ni and Au.

We tape casts alumina to fabricate multi-layer, high temperature cofired ceramics (HTCC). HTCC parts can be fabricated with hermetic vias and hermetic feedthroughs. Laminated alumina tape can be grooved prior to sintering to create HTCC snapstrates. The M/A-COM's HTCC products include: leadless chip carriers, multilayer surface mount substrates, VCSEL packages, and hermetic ceramic feedthroughs for "butterfly" packages. HTCC can be provided in either a white or black color. HTCC products are optimal for applications requiring low loss tangent, high thermal conductivity, high mechanical strength, or hermeticity / ruggedness. We are happy to develop HTCC parts per customer requirements.