Lowell, Massachusetts, March 12, 2018– MACOM Technology Solutions Inc. (“MACOM”), today announced the MAOT-025402 CWDM4 transmitter optical sub-assembly as a part of MACOM’s L-PIC™ (Laser-integrated Silicon Photonic Integrated Circuit) solution for 100Gbps CWDM4. Leveraging our patented L-PIC the MAOT-025402 is designed to mate with the MASC-37053A CDR to form the complete high speed transmit path for QSFP28 CWDM4 solutions. MACOM’s MAOT-025402 CWDM4 L-PIC solution will be on display at OFC 2018, Booth #2613.
As the explosive growth of data traffic and insatiable demand forces Cloud Data Centers to rapidly scale their capabilities, MACOM is equipped to be a leader in the transition from 100Gbps to 400Gbps and from 4G to 5G with a cost-effective, high-performance and highly integrated interconnect chipset solution for CWDM4, scalable to FR4 and FR1/DR1 applications.
Core to the MAOT-025402 is the MAOP-L284CN L-PIC device, which integrates four high-performance 25Gbps CWDM wavelengths in a single silicon photonic integrated circuit (PIC) to communicate 100Gbps over duplex single mode fiber. MACOM’s L-PIC platform provides a highly integrated silicon photonic solution targeting specific data center applications that includes four CW lasers, monitor photodiodes, high bandwidth waveguides, modulators and multiplexers. Utilizing MACOM’s patented self-aligning etched facet technology (SAEFTTM) for precision attachment of the lasers to the silicon chip, the L-PIC platform removes the need for active laser alignment and offers a significant cost reduction to the customer, enabling mainstream deployment.
“MACOM is leveraging our L-PIC platforms to enable leading scalability that meets the rapidly increasing CWDM4 module demand,” said Vivek Rajgarhia, Senior Vice President and General Manager, Lightwave, at MACOM. “The platform’s automated self-aligning calibration and firmware control is anticipated to deliver the requisite combination of scale and cost for mainstream Cloud Data Center deployment.”
MACOM’s L-PIC platform delivers leading bandwidth critical to enabling CWDM4, and is now available in TOSA and at die level. Each L-PIC product includes a companion matched driver and PIC controller. Leveraging this three device chipset, customers are able to significantly reduce engineering risk and achieve faster time-to-market. The accompanying software provides automatic calibration and self-test capabilities, and significantly reduces customers’ capital investment required for production lines. Fully integrated and pre-assembled, MACOM’s sub-assembly platform is expected to provide the high performance required for achieving 100Gbps and 400Gbps data center links while reducing the transceiver manufacturers’ engineering and capital equipment costs, enabling an overall faster time-to-market with lower investment.
MACOM will showcase its optoelectronics portfolio at OFC 2018, Booth #2613, March 13th-15th in San Diego, California. To make an appointment or to view the demonstrations, contact your local sales representative. For more information on MACOM’s optical networking solutions visit: www.macom.com.
MACOM enables a better-connected and safer world by delivering breakthrough semiconductor technologies for optical, wireless and satellite networks that satisfy society’s insatiable demand for information.
Today, MACOM powers the infrastructure that millions of lives and livelihoods depend on every minute to communicate, transact business, travel, stay informed and be entertained. Our technology increases the speed and coverage of the mobile Internet and enables fiber optic networks to carry previously unimaginable volumes of traffic to businesses, homes and datacenters.
Keeping us all safe, MACOM technology enables next-generation radars for air traffic control and weather forecasting, as well as mission success on the modern networked battlefield.
MACOM is the partner of choice to the world’s leading communications infrastructure, aerospace and defense companies, helping solve their most complex challenges in areas including network capacity, signal coverage, energy efficiency and field reliability, through its best-in-class team and broad portfolio of analog RF, microwave, millimeterwave and photonic semiconductor products.
MACOM is a pillar of the semiconductor industry, thriving for more than 60 years of daring to change the world for the better, through bold technological strokes that deliver true competitive advantage to customers and superior value to investors.
Headquartered in Lowell, Massachusetts, MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM has design centers and sales offices throughout North America, Europe, Asia and Australia.
MACOM, M/A-COM, M/A-COM Technology Solutions, M/A-COM Tech, Partners in RF & Microwave, The First Name in Microwave and related logos are trademarks of MACOM. All other trademarks are the property of their respective owners.
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