Mixers

Mixers

MACOM’s mixers can be used in a wide variety of applications such as modulators, phase detectors, frequency synthesizers, and converters. They are ideal for use in CATV head end systems and up converter applications. Our low cost, passive mixers are constructed using broadband ferrite balun transformers and matched silicon Schottky diodes.

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Part Number Ordering Short Description Min Frequency, RF/LO (MHz) Max Frequency, RF/LO (MHz) Min Frequency, IF (MHz) Max Frequency, IF (MHz) Package ROHS Model Data (Sparameters) Product Image LO Drive (dBm) Isolation LO-RF (dB) Input P1dB (dBm) 75 Ohm Package Category Lead-Free Datasheet Application Notes Features Benefits Marking Lead Finish Compatible Parts Conversion Loss (dB) MSL ESD Product Briefs Product Bulletins Outline Drawings Qualification Reports Brightcove Video ADS & SPICE Model Info Data Sheet Package Outline Device Firmware EVM GUI Software EVM User Guides Content Xmicrowave URL Xmicrowave Image
 
 
 
 
 
 
 
 
MAMX-011009 Inquire Sub-Harmonic Pumped Mixer 14 - 32 GHz
4000 32000 0 7000 1.5X1.2mm TDFN-6LD
Yes
1.2x1.5mm_6-lead.jpg
25 No
Plastic Surface Mount
Yes
MAMX-011009.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AG314 - Principles, Applications and Selection of Receiving Diodes
AG314 - Principles, Applications and Selection of Receiving Diodes
Up or Down Frequency Mixer
LO Frequency: 4 - 20 GHz
RF Frequency: 14 - 32 GHz
2xLO & 3xLO Rejection: 50 dB
Low Conversion Loss: 11 dB
Halogen-Free “Green” Mold Compound
Lead-Free 1.5x1.2 mm 6-lead TDFN Package
IF Frequency: DC - 7 GHz
RoHS* Complaint
260°C Reflow Compatible
-10 3203639724001
http://www.xmicrowave.com/product/xm-a4a4-0404d/
Xmicrowave.png
MAMX-009239-001500 Buy E-Series Surface Mount Mixer 10 – 2500 MHz
10 2500 10 2500 SM-87
SM 87 - MAMX-009239-001500.JPG
17 9 13 No
FR4 Surface Mount
No
MAMX-009239-001500.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
Lo Power: +17 dBm
RoHS* Compliant
Wide Frequency Band ·
Surface Mount
Up to +13 dBm RF
Tape and Reel Packaging
9
MAMX-009722-25MHLP Inquire E-Series Surface Mount Mixer 30-512 MHz
30 512 SM-89
SM 89 - MAMX-009722-25MHLP.JPG
23 45 No
FR4 Surface Mount
Yes
MAMX-009722-25MHLP.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
Lo Power: +13 dBm
RoHS* Compliant
260°C Reflow Compatible
Tape and Reel Packaging Available
Surface Mount
Up to +9 dBm RF
7.5
MA4EX600L1-1225T Inquire Silicon Double Balanced HMIC Mixer 1700 – 2500 MHz
4200 6000 0 2000 SOT-25
MA4EX600L1-1225T.PNG
15 28 6.9 No
Plastic Surface Mount
Yes
MA4EX600L1-1225.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
SOT-25 Low Cost Miniature Plastic Package
No External Matching Required
HMICTM Patented Process
+ 3 to + 7 dBm Lo Drive
6.4 dB Typical Conversion Loss @ 5000 MHz
Lead Free ( RoHS Compliant ) with 260 °C Reflow Capability
Double Balanced Passive Mixer
100 % Matte Tin Plating
5.8
MAMX-000900-1061LT Inquire Silicon Double Balanced HMIC Mixer 700—1400 MHz
700 1400 0 400 SOIC8
soic-8.jpg
7 37 1.9 No
Plastic Surface Mount
Yes
MAMX-000900-1061LT.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
+ 3 to + 7 dBm
RoHS* Compliant
100% Matte Tin Plating
Low Cost Surface Mount Package
No External Matching Required
Fully Balanced Passive Mixer
260 °C Reflow Capability
6.7
MA4EXP950H1-1277T Buy Silicon Double Balanced HMIC Mixer 850 - 1050 MHz
850 1050 0 200 3mm PQFN-16LD
3x3 mm-16 lead PQFN (LP).jpg
15 55 12.7 No
Plastic Surface Mount
Yes
MA4EXP950H1-1277T.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AG314 - Principles, Applications and Selection of Receiving Diodes
AG314 - Principles, Applications and Selection of Receiving Diodes
+ 35 dBm Typical Input IP3
RoHS* Compliant with 260 °C. Reflow Capability
Low Cost Miniature Plastic MLP Package
NO External Matching Required
Fully Balanced Passive Mixer
+ 15 to + 19 dBm LO Drive
8. 3 dB Typical Conversion Loss
100% MATTE Tin Plating
8.3
MAMX-008611 Inquire Low Cost MMIC Mixer with Local Oscillator Amplifier 0.8 - 1.0 GHz
800 1000 170 SOT-26
SOT-26.jpg
-5 28 14 No
Plastic Surface Mount
Yes
MAMX-008611.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
-5 to +5 dBm LO Drive Level
260°C Re-flow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead Free SOT-26 package
High Isolation, 28 dB LO to RF
RoHS Compliant Version of MD57-0001
9.3
MAMX-008174-CXD860 Buy E-Series Surface Mount Mixer 1 to 1000 MHz
1 1000 1 1000 SM-134
SM 134.JPG
7 30 1 Yes
Module/Pallet
Yes
MAMX-008174-CXD860.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
Surface Mount
RoHS* Compliant
260°C Reflow Compatible
Low Profile
RF Power up to +1dBm
Lo Power +7dBm
RoHS Version of MAMXES0028
Available on Tape and Reel
7.5
MA4EXP190H1-1277T Inquire High IP3 Double Balanced
1725 2125 0 400 3mm PQFN-16LD
3x3 mm-16 lead PQFN (LP).jpg
15 48 11.3 No
Plastic Surface Mount
Yes
MA4EXP190H1-1277T.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AG314 - Principles, Applications and Selection of Receiving Diodes
AG314 - Principles, Applications and Selection of Receiving Diodes
8.4
MAMX-000950-1225MT Buy Silicon Doubled Balanced HMIC Mixer 700 - 1200 MHz
700 1200 0 400 3mm PQFN-16LD
3x3 mm-16 lead PQFN (LP).jpg
10 62 8.1 No
Plastic Surface Mount
Yes
MAMX-000950-1225MT.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AG314 - Principles, Applications and Selection of Receiving Diodes
AG314 - Principles, Applications and Selection of Receiving Diodes
SOT-25 Low Cost Miniature Plastic Package
100% Matte Tin Plating
DC - 400 MHz IF Bandwidth
Silicon Medium Barrier Schottky Diodes
HMIC™ Patented Process
+7 to +13 dBm LO Drive
7.0 dB Typical Conversion Loss
RoHS* Compliant
260 °C Reflow Capability
8.2
MAMX-007238-CM25MH Buy E-Series Surface Mount Mixer 5-2500 MHz
2 2500 2 2500 SM-87
SM 87 - MAMX-007238-CM25MH.JPG
13 20 1 No
FR4 Surface Mount
Yes
MAMX-007238-CM25MH.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
Lo Power +13 dBm
RoHS* compliant version of the ELCM-25MH
260°C Reflow Compatible
Tape and Reel Packaging Available
Surface Mount
Up to +9 dBm RF
7.3
MAMX-007247-MRS5MH Buy E-Series Surface Mount Mixer 5 – 1500 MHz
5 1500 5 1500 SM-1
SM 1 - MAMX-007247-MRS5MH.JPG
13 30 9 No
Ceramic Surface Mount
Yes
Inquire AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
Lo Power +13 dBm
Tape and Reel Packaging Available
RoHS* Compliant Version of the EMRS-5MH
Surface Mount
Up to +9 dBm RF
7.5
MAMX-007607-ELCM1H Buy E-Series Surface Mount Mixer 0.5 – 500 MHz
0.5 500 0.5 500 SM-87
SM 87 - 2.JPG
17 35 14 No
FR4 Surface Mount
Yes
Inquire AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
LO Power +17 dBm
RoHS* compliant version of the ELCM-1HTR
260°C Reflow Compatible
Tape and Reel Packaging Available
Surface Mount
Low Profile
Up to +14 dBm RF
7.2
MAMX-090950-1277LT Buy Silicon Double Balanced HMIC Mixer 850 - 1050 MHz
850 1050 0 400 3mm PQFN-16LD
3x3 mm-16 lead PQFN (LP).jpg
7 62 4.3 No
Plastic Surface Mount
Yes
MAMX-090950-1277LT.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AG314 - Principles, Applications and Selection of Receiving Diodes
AG314 - Principles, Applications and Selection of Receiving Diodes
Input IP3: +21 dBm (Typ.)
Lead Free
Low Cost Miniature Plastic MLP Package
Fully Balanced Passive Mixer
Lo Drive: +5 to +10 dBm
Conversion Loss: 8.3 dB (Typ,)
100% Matte Tin Plating
260°C Reflow Compatible
RoHS* Compliant
8.2
MA4EXP240L-1277T Buy Silicon Double Balanced HMIC Mixer 2300 - 2800 MHz
2300 2800 0 200 3mm PQFN-16LD
3x3 mm-16 lead PQFN (LP).jpg
5 51 4.8 No
Plastic Surface Mount
Yes
MA4EXP240L-1277.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AG314 - Principles, Applications and Selection of Receiving Diodes
AG314 - Principles, Applications and Selection of Receiving Diodes
+ 18 dBm Typical Input IP3
100 % MATTE Tin Plating
RoHS* Compliant
No External Matching Required
Fully Balanced Passive Mixer
+ 5 to + 9 dBm LO Drive
8. 3 dB Typical Conversion Loss
260 °C Reflow Capability
8.3
MA4EX950L1-1225T Buy Silicon Double Balanced HMIC Mixer 700 - 1200 MHz
700 1200 0 400 SOT-25
Yes
SOT 25.JPG
5 28 1.5 No
Plastic Surface Mount
Yes
MA4EX950L1-1225T.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
SOT-25 Low Cost Miniature Plastic Package •• • • • •
260°C Reflow Capability
100 % Matte Tin Plating
DC - 400 MHz IF Bandwidth
Silicon Low Barrier Schottky Barrier Diodes
HMICTM Patented Process
+3 to +7 dBm LO Drive
6.5 dB Typical Conversion Loss
RoHS* Compliant
8 http://www.xmicrowave.com/product/xm-a4b3-0404d/
Xmicrowave.png
MA4EX190H1-1225T Buy Silicon Double Balanced HMIC Mixer 1700 - 2300 MHz
1700 2300 0 500 SOT-25
Yes
doublebalancedmixer.PNG
15 30 10.5 No
Plastic Surface Mount
Yes
MA4EX190H1-1225T.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Low Cost Miniature Plastic Package
DC - 500 MHz IF Bandwidth
Silicon High Barrier Schottky Diodes
HMIC™ Process
+13 to +17 dBm LO Drive
6.7 dB Typical Conversion Loss at 2200 MHz
6.6 dB Typical Conversion Loss at 1900 MHz
100% MATTE Tin Plating
260 °C. Reflow Capability
RoHS* Compliant
6.6
MA4EX950H1-1225T Buy Silicon Double Balanced HMIC Mixer 700 - 1200 MHz
700 1200 0 400 SOT-25
Yes
MACOM_general.png
15 27.5 8.3 No
Plastic Surface Mount
Yes
MA4EX950H1-1225T.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
7.0 dB Typical Conversion Loss
100% Matte Tin Plating
Low Cost Miniature Plastic Package
DC - 400 MHz IF Bandwidth
Silicon High Barrier Schottky Barrier Diodes
HMIC IC Process
+13 to +17 dBm LO Drive
RoHS* Compliant
260°C Reflow Capability
6.6 http://www.xmicrowave.com/product/xm-a4b2-0404d/
Xmicrowave.png
MAMXSS0013 Inquire Low Cost MMIC Mixer 1400 - 2100 MHz
1400 2100 0 500 SOT-25
Yes
MAMXSS0013.PNG
5 28 12 No
Plastic Surface Mount
Yes
MAMXSS0013.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
+12 dBm Input Power @ 1 dB Compression
RoHS* Compliant Version of MD54-0006
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOT-25 Package
Does Not Require DC Bias
Lo Drive Level: +3 to +8 dBm
High Isolation: 28 dB LO to RF
DC - 500 MHz 3 dB IF Bandwidth
8 http://www.xmicrowave.com/product/xm-a4b6-0404d-2/
Xmicrowave.png
MAMXSS0010 Buy MMIC Medium Level Mixer 1700 - 2000 MHz
1700 2000 0 200 SOIC8
soic-8.jpg
13 27 21 No
Plastic Surface Mount
Yes
MAMXSS0010.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Low Conversion Loss
Lead-Free SOIC-8 Package
DC - 200 MHz IF Bandwidth
Lo Drive Level: +11 to +23 dBm
Typical Two-Tone IM Ratio: > 50 dBc
Input Power @ 1 dB Compression: +21 dBm
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
260°C Reflow Compatible
RoHS* Compliant Version of MD54-0003
8.5
MA4EX580L1-1225T Buy Silicon Double Balanced HMIC Mixer 4.7 - 6.0 GHz
4700 6000 0 1050 SOT-25
Yes
doublebalancedmixer.PNG
5 23 1.6 No
Plastic Surface Mount
Yes
MA4EX580L1-1225T.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Conversion Loss: 7.6 dB (Typ.)
Low Cost Miniature Plastic Package
DC - 1050 MHz IF Bandwidth
Silicon Low Barrier Schottky Diodes
HMIC™ Patented Process
LO Drive : +3 to +7 dBm
Lead Free
RoHS* Compliant
7.6 http://www.xmicrowave.com/product/xm-a4a9-0404d/
Xmicrowave.png
MAMXSS0012 Inquire Low Cost MMIC Mixer 800 - 1000 MHz
800 1000 0 200 SOT-25
Yes
SOT 25.JPG
5 35 15 No
Plastic Surface Mount
Yes
MAMXSS0012.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Input Power @ 1 dB Compression: +15 dBm
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOT-25 Package
Does not require DC Bias
DC - 200 MHz 3 dB IF Bandwidth
LO Drive Level: +3 to +8 dBm
High LO to RF Isolation: 35 dB
260°C Reflow Compatible
RoHS* Compliant Version of MD54-0005
8 http://www.xmicrowave.com/product/xm-a4b5-0404d/
Xmicrowave.png
MA4EX240L1-1225T Buy Silicon Double Balanced HMIC Mixer 1700 - 2500 MHz
1700 2500 0 400 SOT-25
Yes
doublebalancedmixer.PNG
5 17.5 1 No
Plastic Surface Mount
Yes
MA4EX240L1-1225T.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Low Cost Miniature Plastic Package
Silicon Low Barrier Schottky Diodes
HMIC™ Patented Process
+3 to +7 dBm LO Drive
7.4 dB Typical Conversion Loss at 2400 MHz
6.4 dB Typical Conversion Loss at 2100 MHz
RoHS* Compliant with 260 °C. Reflow Capability
DC - 400 MHz IF Bandwidth
100% MATTE Tin Plating
7 http://www.xmicrowave.com/product/xm-a4a8-0404d/
Xmicrowave.png
MAMXES0117 Buy E Series Surface Mount Mixer 1-1000 MHz RoHS Compliant
80 2500 0 1000 SM-2
SM 2 - Module Pallet.jpg
17 28.9 14 No
Module/Pallet
Yes
MAMXES0117.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
LO Power: +17 dBm
Tape and Reel Packaging Available
RoHS* Compliant version of the ESMD-C50H
Surface Mount
Up to +14 dBm RF
7.34
MAMXSS0011 Inquire MMIC Medium Level Mixer 800 - 1000 MHz
800 1000 0 100 SOIC8
soic-8.jpg
13 38 21 No
Plastic Surface Mount
Yes
MAMXSS0011.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Low Conversion Loss
RoHS* Compliant Version of MD54-0004
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOIC-8 Package
DC - 100 MHz IF Bandwidth
Lo Drive Level: +11 to +23 dBm
1 dB Compression: +21 dBm
7.5
MAMXES0115 Buy E-Series Surface Mount Mixer 1 – 1000 MHz
5 1000 0 1000 SM-89
MACOM_general.png
7 25 1 No
FR4 Surface Mount
Yes
MAMXES0115.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
Lo Power: +7 dBm
RoHS* Compliant
Tape and Reel Packaging Available
Low Profile
Surface Mount
Up to +1 dBm RF
260 °C Reflow Capability
7
XM1003-BD Inquire Image Reject Mixer 32.0-42.0 GHz
32000 42000 0 4000 DIE
MACOM_general.png
-40 No
Die
Yes
XM1003-BD.pdf
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
Sub-harmonic Image Reject Mixer
100% Visual Inspection to MIL-STD-883 Method 2010
100% On-Wafer RF Testing
Image Rejection: 18.0 dB
Conversion Loss: 9.0 dB
GaAs HBT Technology
260°C Reflow Compatible
RoHS* Compliant
9
XM1001-BD Inquire Image Reject Mixer 12.0-40.0 GHz
12000 40000 0 4000 DIE
MACOM_general.png
16 No
Die
Yes
XM1001-BD.pdf
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
Fundamental Image Reject Mixer
RoHS* Compliant
260°C Reflow Compatible
100% Visual Inspection to MIL-STD-883 Method 2010
100% On-Wafer RF Testing
Image Rejection: 20.0 dB
Conversion Loss: 8.0 dB
+25.0 dBm Input Third Order Intercept (IIP3)
8
XM1002-BD Inquire Image Reject Mixer 34.0-46.0 GHz
34000 46000 0 4 DIE
MACOM_general.png
11 No
Die
Yes
XM1002-BD.pdf
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
Fundamental Image Reject Mixer
260°C Reflow Compatible
100% Visual Inspection to MIL-STD-883 Method 2010
100% On-Wafer RF Testing
+24 dBm Input Third Order Intercept
20.0 dB Image Rejection
7.0 dB Conversion Loss
RoHS* Compliant
8
MAMX-000600-1225MT Inquire Silicon Doubled Balanced HMIC Mixer 4200 - 6000 MHz
4200 6000 0 2000 SOT-25
Yes
doublebalancedmixer.PNG
10 27 2.7 No
Plastic Surface Mount
Yes
MAMX-000600-1225MT.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
SOT-25 Low Cost Miniature Plastic Package
100% Matte Tin Plating
RoHS* Compliant
260 °C Reflow Capability
Double Balanced Passive Mixer
Silicon Medium Barrier Schottky Diodes
HMIC™ Patented Process
LO Drive: +7 to +13 dBm
6.5 dB Typical Conversion Loss
6.5
MAMX-007253-ES0067 Inquire E-Series Surface Mount Mixer 10 – 2000 MHz
10 2000 10 800 SM-2
SM 2 - Module Pallet.jpg
10 30 No
Module/Pallet
Yes
Inquire AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
LO Power +10 dBm
260°C Reflow Compatible
Tape and reel packaging available
Surface Mount
5 dBm RF
RoHS* compliant version of the MAMXES0067
8
MAMX-011023 Inquire Low Noise Active Mixer, 4 – 23 GHz
4000 23000 0 8000 1.5x1.2mm 6 lead TDFN
1.2x1.5mm_6-lead.jpg
-2 No
Plastic Surface Mount
Yes
MAMX-011023 (1).pdf
Down Frequency Mixer
LO Frequency: 4 – 23 GHz
RF Frequency: 4 – 23 GHz
Low Power Consumption: 3v/15mA
Low Noise: 7 dB Typical
Conversion Gain: 7 dB Typical
Halogen-Free “Green” Mold Compound
Lead-Free 1.5x1.2mm 6 lead TDFN Pkg
IF Frequency: DC – 8 GHz
RoHS Complaint and 260oC Reflow
7 Family of Mixers Training Module with Digikey.pdf
MAMX-011021 Inquire High IP3 Mixer, 5 - 33 GHz
5000 33000 0 5000 1.5x1.2mm 6 lead TDFN
Yes
1.2x1.5mm_6-lead.jpg
14 15 No
Plastic Surface Mount
Yes
MAMX-011021.pdf
Passive Frequency Mixer
LO Frequency: 3-39 GHz
RF Frequency: 5-33 GHz
High IIP3: +22 dBm
Conversion Loss : 9 dB typical
Lead-Free 1.5x1.2mm 6 lead TDFN Package
IF Frequency: DC-5 GHz
RoHS* Compliant and 260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
9 Family of Mixers Training Module with Digikey.pdf
http://www.xmicrowave.com/product/xm-a4a5-0404d/
Xmicrowave.png
MD-156 Inquire 600 3000 0 1000 FP-2
Flatpack package.png
30 FP-2
Inquire Noise Figure: 6.5 Typical
MIL-STD-883 Screening Available
IF Port Current: 50 mA Max
Maximum Input Power: 300 mW max. @ 25°C, Derated linearly to 85°C @ 3.2 mW/°C
Impedance: 50 Ohms Nominal
LO-RF Isolation: 30 dB Typical
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