Precision Ceramic Packaging for Electronics
M/A-COM produces ceramic packaging
for electronic devices.
We specialize in the manufacture of custom and standard designs
for RF, Microwave, and Optoelectronics applications.
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Ceramic Green Tape Casting
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Conductor Printing
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Multi-Layer Hermetic Assemblies
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High Temperature Sintering
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Refractory Metallizing
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Alumina and BeO ceramic assemblies
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Kovar, Alloy42, Copper-Tungsten, and
Copper Heat Sinks
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Complete in-house electroplating and
brazing
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In-house tooling capabilities
We use in-house technology to assure consistent
quality and fast turn-around for your custom or our stock catalog
designs. Ask us about packaging for your application.
Packages/Substrates - Overview
