RF Power Packages
LDMOS / BiPolar
M/A-COM provides
standard and custom packages for silicon bipolar
and LDMOS RF power transistors. Packages are available in
either hermetic or non-hermetic versions, with surface mount
or bolt-down flanges. Packages incorporate alumina and/or
beryllia with a thick film tungsten metallization. The flange
material can be copper, copper-tungsten or copper-moly-copper.
Advanced engineered materials are actively pursued to meet
ever increasing power demands.
Green Tape Alumina
The M/A-COM green tape alumina process provides
the ability to supply RF customers with a wide variety of both
standard and customized LDMOS package styles.
Metal Matrix Flanges
Utilizing metal matrix flanged bases, materials
offered to attain superior thermal dissipation include Copper/Tungsten
and Copper/Moly/Copper. To meet ever increasing power demands,
we actively seeks advanced engineered materials to further
expand current package properties.
Tool Designs
Tooled designs are presently available in two- and four-leaded configurations with a variety of dimensional options.
High volume production capacity as well as “Quick-Turn” prototype
quantities are available with a total commitment to quality
and on-time delivery.
We provide our customers with the best economics,
delivery and service required to give the competitive edge
needed in today’s everchanging market.
Take advantage of our material options and quick
response time to satisfy your packaging needs. Contact our
Customer Service Department for current standard packages offered
or package customization to fit your needs.
|
