MNS

Capacitors

MACOM's chip capacitors are used extensively in commercial and aerospace and defense applications. Our capacitors are designed for long-term reliability and repeatable performance in a variety of hybrid microwave circuit applications operating up through the Ku-band frequency. MACOM’s capacitors have the distinct advantage of higher capacitance per unit area, resulting in smaller chips for a given capacitance. 

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Part Number Ordering Short Description Capacitance (pf) Standoff Voltage (V) Chip Style ADS & SPICE Model Info Application Notes Benefits Brightcove Video Compatible Parts Content Data Sheet Package Outline Datasheet Device Firmware ESD EVM GUI Software EVM User Guides Features Lead Finish Lead-Free MSL Marking Model Data (Sparameters) Outline Drawings Package Package Category Pad Types Product Briefs Product Bulletins Product Image Qualification Reports ROHS
 
 
 
MA4M2020 Buy MNS Microwave Chip Capacitors
20 200 132 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Round Bonding Pad
MACOM_general.png
MA4M1100 Buy MNS Microwave Chip Capacitors
100 100 199 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Round Bonding Pad
MACOM_general.png
MA4M3150 Inquire MNS MW Chip
150 50 359 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Square Bonding Pad
MACOM_general.png
MA4M1050 Inquire 1 MNS Microwave Chip Capacitors
50 100 132 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Round Bonding Pad
MACOM_general.png
MA4M3030 Buy MNS Microwave Chip Capacitors
30 200 352 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Square Bonding Pad
MACOM_general.png
MA4M3010 Buy MNS Microwave Chip Capacitors
10 200 350 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot) • • •
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Square Bonding Pad
MACOM_general.png
MA4M3100 Buy MNS Microwave Chip Capacitors
100 50 358 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Square Bonding Pad
MACOM_general.png
MA4M3050 Buy MNS Microwave Chip Capacitors
50 200 354 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Square Bonding Pad
MACOM_general.png