MACOM's product line of packaged PIN diodes represents a comprehensive combination of PIN diode electrical characteristics and package outlines. This union of semiconductor and packaging technology gives considerable design flexibility to the PIN diode circuit designer. The fast switching speed PIN diodes utilize thin I-region silicon dioxide passivated chips that incorporate careful control of semiconductor processing. These diodes achieve consistent performance in control circuit applications. The packaged CERMACHIP PIN diodes employ MACOM's unique hard glass passivated, hermetically sealed PIN diode chip. The packaged CERMACHIP PIN diodes are designed for use in high power and high RF voltage applications. The PIN diode chips are bonded into hermetically sealed ceramic or glass packages that are designed for high volume, close tolerance utilization. Packages are available which are suitable for mounting in a variety of microwave and RF circuit media. The packaged silicon PIN diode series has high inherent reliability and is capable of meeting stringent environmental tests. These diodes may be ordered with testing to selected reliability levels.