The chip used in the MA4PH611 is manufactured using a unique, CERMACHIP, passivation process which provides for a hard glass encapsulation that protects and hermetically seals the active area of the chip. This packaged, CERMACHIP, PIN diode is ideally suited for use in applications where high RF and DC voltages are present.
The chip is enclosed in a rugged, ceramic, Metal Electrode Leadless Faced (MELF), surface mount package that is full face bonded to refractory metal plugs on both the anode and cathode. The result is
a low loss PIN diode with low thermal resistance due to its symmetrical thermal paths. MELF PIN diodes are designed specifically for high volume tape and reel assembly. Their user friendly design provides for extremely easy, automatic, pick and place, indexing and assembly. All solderable surfaces are tin plated and are compatible with all industry standard reflow and vapor phase solder