Product Detail

MADP-000208-13180W
Diode Pair
The MADP-000208-13180W is a pair of silicon glass PIN diodes incorporated onto one chip and is fabricated using MACOM's patented HMICTM process. The device features three silicon pedestals embedded in low loss, low dispersion glass (k=4.1, Tand=0.002). The diodes are formed on the top of pedestals and connections to the backside of the device are made via electrically conductive sidewalls. Selective backside metallization is applied to produce a surface mount device. This vertical topology provides for exceptional heat transfer and also allows the topside to be fully encapsulated with silicon nitride. An additional polymer layer is also added to provide scratch and impact protection. These protective coatings prevent damage to the junction and the anode airbridge during handling and assembly. The MADP-000208-13180W packageless devices are suitable for usage in high incident power, 44.8 dBm C.W at 2 GHz., series, shunt, or series-shunt switches. The low parasitic inductance, < 0.12 nH, and excellent RC constant, make these devices an attractive alternative for high frequency switch elements when compared to their plastic device counterparts.
Features
  • Surface Mount Device
  • Low Parasitic Capacitance and Inductance
  • Polymer Scratch Protection
  • Silicon Nitride Passivation
  • Rugged Silicon-Glass Construction
  • No Wire bonds Required
  • Two PIN diodes in Flexible Configuration
  • 8 ┬Ám I-Region Length Devices
Applications
  • ISM
Specifications
  • Resistance: 0.4 Ohm
  • Total Capacitance: 0.81 pF
  • Total Capacitance: 0.81 pF
  • CW Power Dissipation: 2.6 W
  • Min Frequency: 30 MHz
  • Thermal Resistance: 58 
  • Breakdown Voltage, Minimum: 90 V
  • Lifetime: 500 nS
  • Max Frequency: 1,800 MHz
Package
  • ODS-1318 Surmount
Package Category
  • Surface Mount Die
Part Number Package MACOM Richardson RFPD DigiKey Mouser
MADP-000208-13180W
Diode, HMIC, PIN SeriesT, Surmount
ODS-1318 SURMOUNT Inquire

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