Product Detail

MADP-017015-1314
Surmount PIN Diode
This device is a silicon, glass PIN diode surmount chip fabricated with MACOM’s patented HMIC™ process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptional heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. These packageless devices are suitable for usage in moderate incident power, = 50dBm/C.W. or where the peak power is = 75dBm, pulse width is = 1µS, and duty cycle is = 0.01%. Their low parasitic inductance, 0.4 nH, and excellent RC constant, make these devices a superior choice for higher frequency switch elements when compared to their plastic package counterparts.
Features
  • 0603 Outline
  • High Average and Peak Power Handling
  • Low Parasitic Capacitance and Inductance
  • Polymer Scratch Protection
  • Silicon Nitride Passivation
  • No Wirebonds Required
  • 15µm I-Region Length Devices
  • Surface Mount
Applications
  • Aerospace and Defense
  • ISM
Specifications
  • Total Capacitance: 0.32 pF
  • Total Capacitance: 0.32 pF
  • Resistance: 0.7 Ohm
  • Min Frequency: 1 MHz
  • CW Power Dissipation: 5 W
  • Thermal Resistance: 30 
  • Breakdown Voltage, Minimum: 115 V
  • Lifetime: 1,300 nS
  • Max Frequency: 6,000 MHz
Package
  • ODS-1314 die
Package Category
  • Surface Mount Die
Part Number Package MACOM Richardson RFPD DigiKey Mouser
MADP-017015-13140G
Diode, PIN, HMIC, Surmount
"ODS-1314, GEL PACK"
In Stock: 1400
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In Stock: 500
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In Stock: 400
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