Heterolithic Microwave Integrated Circuit (HMIC)

MACOM's Commitment to HMIC

“HMIC technology enables complex integration of virtually all high frequency technologies. At MACOM we leverage this technology to provide solutions that allow our customers to choose the best semiconductor junction for the required system function.”

Tim Boles
Director of Strategy - Standard Products 

RF & Microwave Product Selection Guide

MACOM's HMIC Technology Ensures IC Size, Reliability & Cost Advantage

Heterolithic Microwave Integrated Circuit Technology

Heterolithic Microwave Integrated Circuit (HMIC) is a complex technology developed at MACOM that joins two different materials, glass and silicon, into a single monolithic structure. The technology integrates the best properties of each material and therefore allows monolithic circuit solutions that reduce both size and cost. HMIC should be viewed as a companion to GaAs and Silicon MMIC technology. HMIC focuses on the use of automated batch process fabrication and testing technologies to produce resistive and reactive, lumped elements which encompass small size and low loss for high performance microwave integrated circuits. This is applied at the wafer level, to substantially reduce the size, cost and performance limitations while significantly improving the reliability and repeatability of conventional diode, active, passive, hybrid and chip-and-wire microwave circuits. 

Key Advantages

  • Cost effective
  • Improves reliability and repeatability
  • Enables broadband performance
  • Flexible manufacturing technology
  • Exploits properties of both glass and silicon
    • Glass- Low dielectric constant & low high frequency loss tangent
    • Silicon- High thermal conductivity & low electrical resistance

Key Applications

  • CATV and Wired broadband
  • Wireless backhaul
  • Industrial, Scientific & Medical
  • Test and Measurement
  • Chip and wire high frequency microwave applications