CIOE 2017

You're invited to meet with MACOM experts at CIOE 2017 at the Shenzhen Convention
and Exhibition Center, September 6th – 9th, in Booth #1A32 and discover how MACOM
is decreasing size and power consumption, and increasing port density of optical
interconnects.
Members of MACOM’s product management, engineering and applications teams will be
available to answer any inquiries or questions at the show.
For more information, please visit our booth at CIOE or contact us via www.macom.com.
Additional Information and Resources:
For more information about CIOE 2017 click here
For more information about MACOM click here
Show Information:
Shenzhen Convention &
Exhibition Center
For the complete show oor
map click here
Visit Booth #1A32 to meet
with experts and learn how
MACOM can help solve your
unique application design
challenges.
Wednesday September 6th:
9:00 AM – 5:00 PM
Thursday September 7th:
9:00 AM – 5:00 PM
Friday September 8th:
9:00 AM – 5:00 PM
Saturday September 9th:
9:00 AM – 4:00 PM 100G, 200G & 400G Demo
Chinese
Sept 6: 11:30 AM, 2:00 PM
Sept 7: 10:00 AM, 3:30 PM
Sept 8: 12:00 PM, 2:30 PM
Sept 9: 10:00 AM
English
Sept 6: 10:00 AM, 3:30 PM
Sept 7: 11:30 AM, 2:00 PM
Sept 8: 10:30 AM, 4:00 PM
Sept 9: 11:30 AM
Chinese
Sept 6: 12:00 PM, 2:30 PM
Sept 7: 10:30 AM, 4:00 PM
Sept 8: 11:30 AM, 2:00 PM
Sept 9: 10:30 AM
English
Sept 6: 10:30 AM, 4:00 PM
Sept 7: 12:00 PM, 2:30 PM
Sept 8: 10:00 AM, 3:30 PM
Sept 9: 12:00 PM
L-PIC Demo
MACOM’s product displays at CIOE this year include:
• GPON ONU BOSA-on-Board
• 10G-PON ONU/OLT Chipset
• 25G Wireless/Enterprise Chipset
• 100G SR4 VCSEL Chipsets
• 25G SR VCSEL Chipset
• 100G LR4 Solution
• 100G PSM4
• 100G 1x53 GBaud
• 400G 4x53 GBaud
• 100G CWDM4 Silicon Photonics L-PIC and R-PIC Receiver
• Long Haul/Metro Application Solutions

@MACOMtweets

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