Cloud Data Center

Open Eye MSA Consortium

Industry Leaders Form Open Eye MSA Consortium Targeting High Speed Optical Connectivity Applications

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MACOM Blog

Solving the Need for Speed in Cloud Data Centers with Etched Facet Technology

The demand by Cloud Data Centers for faster data delivery speeds at cost-effective prices is growing rapidly. Higher speeds are necessary to process... Read More

MACOM’s Commitment

MACOM is playing a leading role enabling the upgrade from 10G to 100G optical connectivity within Cloud Data Centers.  We uniquely bring to bear the proven cost structure, capacity and supply chain flexibility that achieved preeminent market share in the PON Access market, and products and platform innovation that achieved similar success with 100G technology in Long Haul, Metro and DCI networks.

Cloud Data Center

Introduction

The demand by Cloud Data Centers for faster data delivery speeds at cost-effective prices is growing rapidly, where higher speeds are necessary to process the current growth in traffic. The pace of cloud data center capacity expansion has created a change in the traditional model of network equipment development and deployment. Equipment vendors need to cut development cycles while bringing cost optimized solutions to market. To solve these challenges, MACOM is focused on complete chip-set solutions and discrete components that enable our customers to deliver optical transceivers that meet the requirements of today’s cloud data center deployments.

  • Complete product portfolio of PAM-4 PHY, TIAs, Modulator Drivers, Lasers, and Silicon Photonics
  • Individual component designs are optimized for use together as a chip-set
  • Integrated subassemblies
  • Components are tested and characterized together
  • System firmware designed to manage all components
  • Software API for ease of use and integration
  • Consolidated support resources
  • Consolidated suppy chain and ordering

Why Serial 100 Gbps is Pivotal

Learn how MACOM's serial 100 Gbps solution achieves lowest cost, lowest power, highest density, and is compatible with 400 Gbps and next-generation switch ASICs.

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