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MACOM’s attenuators are used in a variety of applications for automotive and wireless markets, including 75 Ohm versions for CATV. We offer serial and parallel logic controlled digital attenuators and voltage variable analog attenuators (VVAs) that range from DC to 40GHz. Typical applications include; CATV Infrastructure, Cellular infrastructure, Handset gain control, Radar systems, Satellite radios and Test equipment.
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Parametric Search
| releaseDate | Part Number | Ordering | Min Frequency (MHz) | Max Frequency (MHz) | Bit Count | Attenuator Range (dB) | Insertion Loss (dB) | LSB (dB) | IIP3 (dBm) | Package | Model Data (Sparameters) | Package Category | Lead-Free | Datasheet | Application Notes | TTL Driver | Features | Marking | Lead Finish | Product Image | Short Description | ROHS |
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| 2014/05/14 | MAAD-011021 | Buy | 0 | 30000 | 6 | 31.5 | 6 | 0.5 | 38 |
3mm PQFN-16LD
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fr_MAAD-011021_Packaged_probed_on_smb.zip
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Plastic Surface Mount
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Yes
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MAAD-011021.pdf
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No
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6-bit, 0.5 dB LSB, 31.5 dB range
Low RMS phase 4.3° @ 20 GHz
+/- 0.5 dB typical bit error
Integrated TTL 0/+5V control
DC to 30 GHz operation
ESD protection for all controls and bias
Lead-Free 3 mm 16-lead PQFN package
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Digital Attenuator, 6-Bit, 0.5 dB LSB step
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Yes
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| 2014/05/14 | MAAD-011021-DIE | Inquire | 0 | 40000 | 6 | 31.5 | 6 | 0.5 | 38 |
DIE
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MAAD-011021-000die__7312013_probed_on_die.zip
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1.55 x 0.95 x 0.1 mm
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Yes
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MAAD-011021-000DIE.pdf
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No
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6-bit, 0.5 dB LSB, 31.5 dB range
+/- 0.5 dB typical bit error
Integrated TTL 0/+5V control
DC to 40 GHz operation
ESD protection for all controls and bias
Die size: 1.55 x 0.95 x 0.1 mm
Low RMS phase 4.3° @ 20 GHz
100% On-wafer DC & RF Tested
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Digital Attenuator, 6-Bit, 0.5 dB LSB step
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Yes
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| 2012/08/07 | MAADSS0019 | Buy | 2000 | 6000 | 4 | 15 | 1.9 | 1 | 42 |
3mm PQFN-16LD
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Plastic Surface Mount
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Yes
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MAADSS0019.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
No
|
Integrated e/d Logic on Chip
RoHS* Compliant
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
Lead-Free 3 mm 16-Lead PQFN Package
1 dB Attenuation Steps to 15 dB
42 dBm Typical @ 2.0 GHz
Insertion Loss 1.9 dB @ 6.0 GHz
Positive Single Control
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3x3 mm-16 lead PQFN.jpg
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Digital Attenuator, 4-Bit, Single Control 15 dB, 2.0 - 6.0 GHz
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Yes
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|||
| 2010/09/24 | MAAD-008790-000100 | Buy | 0 | 4000 | 5 | 31 | 5.5 | 1 | 37 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAAD-008790.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 1.0 dB Steps to 3.0 dB
RoHS* Compliant
Test Boards are Available
50 ohm Impedance
Integral TTL Driver
Small Footprint, PQFN Package
Low DC Power Consumption
Phase error: ± 3º Typical at 2 GHz
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CSP 1 - 6 x 4 32 Lead.JPG
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Constant Phase Digital Attenuator 31.0 dB, 5-Bit, TTL Driver, DC-4.0 GHz
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||||
| 2008/11/22 | MAAD-007084-000100 | Buy | 0 | 2000 | 5 | 15.5 | 3 | 0.5 | 48 |
SOW16
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Plastic Surface Mount
|
Yes
|
MAAD-007084.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Attenuation: 0.5 dB Steps to 15.5 dB
RoHS* Compliant Version of AT65-0283
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOW-16 Package
Tape and Reel Packaging Available
Test Boards are Available
50 Ohm Impedance
Integral TTL Driver
Low DC Power Consumption
|
SOW 16.jpg
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Digital Attenuator 15.5 dB, 5-Bit, TTL Driver, DC-2.0 GHz
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||||
| 2008/01/31 | MAAD-009170-000100 | Buy | 50 | 4000 | 5 | 15.5 | 5.2 | 0.5 | 40 |
4x6mm PQFN-32LD
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Plastic Surface Mount
|
Yes
|
MAAD-009170.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 0.5 dB Steps to 15.5 dB
RoHS* Compliant
Test Boards are Available
50 ohm Impedance
Integral TTL Driver
Small Footprint, PQFN Package
Low DC Power Consumption
Minimal Phase Variation over Attenuation Range
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator, Constant Phase 15.5 dB, 5-Bit, TTL Driver, DC-4.0 GHz
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||||
| 2008/01/31 | MAAD-009195-000100 | Buy | 50 | 3000 | 5 | 15.5 | 5.3 | 0.5 | 40 |
CR-12
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Ceramic Surface Mount
|
Yes
|
MAAD-009195.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Attenuation: 0.5 dB steps to 15.5 dB
RoHS* Compliant
260°C Reflow Compatible
50 ? Nominal Impedance
Integral TTL Driver
Hermetic Surface Mount Package
Low DC Power Consumption
Minimal Phase Variation over Attenuation Range
|
CR 12.JPG
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Constant Phase Digital Attenuator 15.5 dB, 5-Bit, TTL Driver, DC-3.0 GHz Rev.
|
||||
| 2008/01/03 | MAAD-009194-000100 | Buy | 50 | 3000 | 5 | 31 | 5.3 | 1 | 41 |
CR-12
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Ceramic Surface Mount
|
Yes
|
MAAD-009194.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Attenuation: 1 dB steps to 31 dB
RoHS* Compliant
260°C Reflow Compatible
50 ? Nominal Impedance
Integral TTL Driver
Hermetic Surface Mount Package
Low DC Power Consumption
Minimal Phase Variation over Attenuation Range
|
CR 12.JPG
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Constant Phase Digital Attenuator 31.0 dB, 5-Bit, TTL Driver, DC-3.0 GHz
|
||||
| 2008/01/02 | MAATSS0019 | Buy | 500 | 4000 | 4 | 15 | 1.3 | 1 | 47 |
TSSOP16
|
MAATSS0019_SPAR.zip
|
Plastic Surface Mount
|
Yes
|
MAATSS0019.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
Single Control CMOS Logic for Each Bit
RoHS* Compliant
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free TSSOP-16 Package
Low DC Power Consumption: 50 µW
1 dB Steps to 15 dB
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TSSOP-16.jpg
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Digital Attenuator, 4-Bit, Single Control, 15 dB 0.5 - 4.0 GHz
|
|||
| 2007/12/05 | MAAD-007081-000100 | Buy | 0 | 3500 | 5 | 15.5 | 3.2 | 0.5 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAAD-007081.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 0.5 dB Steps to 15.5 dB
RoHS* Compliant Version of AT90-0283
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Test Boards are Available
50 ohm Impedance
Integral TTL Driver
Small Footprint, JEDEC Package
Low DC Power Consumption
Lead-Free CSP-1 Package
Tape and Reel Packaging Available
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 15.5 dB, 5-Bit, TTL Driver, DC-3.5 GHz
|
||||
| 2007/09/21 | MAADSS0016 | Buy | 50 | 4000 | 5 | 31 | 1.5 | 1 | 42 |
3mm PQFN-16LD
|
MAADSS0016_Spars_Major_states.zip
|
Plastic Surface Mount
|
Yes
|
MAADSS0016.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
No
|
Integrated Logic
RoHS* Compliant
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
Lead-Free 3mm PQFN-16LD Plastic Package
Low DC Power Consumption
1-dB Attenuation Steps to 31 dB
Attenuation Accuracy: 0.3 dB + 1% @ 1.0 GHz
-40 dBm typical @ 2.0 GHz
Insertion Loss: 1.5 dB @ 1.0 GHz
Positive Single Control
|
3x3 mm-16 lead PQFN.jpg
|
Digital Attenuator, 5-Bit, Single Control 31 dB, 0.05 - 4.0 GHz
|
|||
| 2007/07/11 | MAAD-007079-000100 | Buy | 0 | 2500 | 4 | 30 | 2.7 | 2 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAAD-007079.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 2 dB Steps to 30 dB
RoHS* Compliant Version of AT90-1233
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free CSP-1 Package
Tape and Reel Packaging Available
Test Boards Available
50 Ohm Impedance
Integral TTL Driver
Contains Internal DC to DC Converter
Single Positive Supply
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 30.0 dB, 4-Bit, TTL Driver, DC-2.5 GHz
|
||||
| 2007/07/09 | MAAD-007080-000100 | Buy | 0 | 2400 | 6 | 50 | 6 | 1 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAAD-007080.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 1 dB Steps to 50 dB
RoHS* Compliant Version of AT90-1106
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free CSP-1 Package
50 ohm Impedance
Integral TTL Driver
Small Footprint, JEDEC Package
Low DC Power Consumption
Contains Internal DC to DC Converter
Single Positive Supply
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 50.0 dB, 6-Bit, TTL Driver, DC-2.4 GHz Rev
|
||||
| 2007/05/28 | MAADSS0012 | Buy | 800 | 8000 | 1 | 21 | 0.6 | 21 | 41 |
2mm PDFN-8LD
|
MAADSS0012.zip
|
Plastic Surface Mount
|
Yes
|
MAADSS0012.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
No
|
Vc: 2.5
IP1dB: 25
RoHS* Compliant
260°C Re-flow Compatible
21 dB Step Attenuator
Halogen-Free “Green” Mold Compound
Lead-Free 2mm 8-Lead PDFN Package
-42 dBm typical @ 2.0 GHz
Current Consumption: 40 µA typical
Insertion Loss: 0.75 dB typical @ 2.0 GHz
Positive Control: 2.5 V typical
|
12
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
2x2mm_8-lead PQFN.jpg
|
Digital Attenuator, 1-Bit, Single Control 21 dB, 0.8 - 8.0 GHz
|
Yes
|
| 2007/03/31 | MAATCC0012 | Buy | 0 | 2500 | 4 | 30 | 2.7 | 2 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAATCC0012.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 2 dB Steps to 30 dB
RoHS* Compliant Version of AT90-0233
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free CSP-1 Package
Tape and Reel Packaging Available
Test Boards Available
50 Ohm Impedance
Integral TTL Driver
Small Footprint, JEDEC Package
Low DC Power Consumption
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 30.0 dB, 4-Bit, TTL Driver, DC-2.5 GHz
|
||||
| 2007/02/02 | MAAD-007077-000100 | Buy | 50 | 4000 | 4 | 15 | 2.5 | 1 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAAD-007077.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 1 dB Steps to 15 dB
RoHS* Compliant Version of AT90-1413
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
00% Matte Tin Plating over Copper
Lead-Free CSP-1 Package
Tape and Reel Packaging Available
Test Boards Available
50 Ohm Impedance
Integral TTL Driver
Contains Internal DC to DC Converter
Single Positive Supply
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 15 dB, 4-Bit, TTL Driver, DC-4.0 GHz
|
||||
| 2006/09/17 | MAATCC0014 | Buy | 0 | 3500 | 5 | 15.5 | 3.2 | 0.5 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAATCC0014.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 0.5 dB Steps to 15.5 dB
RoHS* Compliant Version of AT90-1283
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free CSP-1 Package
50 ohm Impedance
Integral TTL Driver
Small Footprint, JEDEC Package
Low DC Power Consumption
Single Positive Supply
Contains Internal DC to DC Converter
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 15.5 dB, 5-Bit, TTL Driver, DC-3.5 GHz
|
||||
| 2006/08/29 | MAADSS0009 | Buy | 0 | 2000 | 4 | 30 | 1.6 | 2 | 50 |
SOIC16
|
Plastic Surface Mount
|
Yes
|
MAADSS0009.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
IP1dB: 28, LSB: 2.0
Vc: 5.0
RoHS* Compliant Version of AT-220
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOIC-16 Plastic Package
Temperature Stability +/-0.15 dB: -40°C to +85°C
Attenuation 2-dB Steps to 30 dB
Low DC Power Consumption: 50 µW
Low Intermodulation Product: +50 dBm IP3
High Accuracy
|
MAADSS0009
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
soic-16.jpg
|
Digital Attenuator, 30 dB, 4-Bit DC - 2.0 GHz
|
Yes
|
|
| 2006/06/22 | MAAD-007083-000100 | Buy | 0 | 6000 | 5 | 31 | 3 | 1 | 48 |
4x6mm PQFN-32LD
|
maad-007083_s2p_files.zip
|
Plastic Surface Mount
|
Yes
|
MAAD-007083.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
IP1dB: 24.0, LSB: 1
Vc: 5.0?
RoHS* Compliant Version of AT90-0001
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free CSP-1 Package
Tape and Reel Packaging Available
Test Boards are Available
Integral TTL Driver
Small Footprint, JEDEC Package
High Accuracy to 6 GHz
Attenuation: 1.0 dB Steps to 31 dB
50 ohm impedance
|
AD00708301
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator, 31.0 dB, 5-Bit, TTL Driver, DC-6.0 GHz
|
|
| 2006/05/25 | MAAD-007078-000100 | Buy | 0 | 3000 | 5 | 31 | 3.5 | 1 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAAD-007078.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 1.0dB Steps to 31dB
RoHS* Compliant Version of AT90-1263
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free CSP-1 Package
50 ohm Impedance
Integral TTL Driver
Small Footprint, JEDEC Package
Low DC Power Consumption
Contains internal DC to DC converter
Single Positive Supply
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 31.0 dB, 5-Bit, TTL Driver, DC-3.0 GHz
|
||||
| 2006/05/01 | MAAD-007086-000100 | Buy | 0 | 2000 | 6 | 50 | 3.5 | 1 | 48 |
SOW24
|
Plastic Surface Mount
|
Yes
|
MAAD-007086.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
IP1dB: 24, LSB: 1.0
Vc: 5.0?
RoHS* Compliant Version of AT65-0106
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOW-24 Package
Tape and Reel Packaging Available
Test Boards are Available
Attenuation: 1 dB Steps to 50 dB
50 ohm Impedance
Integral TTL Driver
Low DC Power Consumption
RoHS* Compliant Version of AT65-0106
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOW-24 Package
Tape and Reel Packaging Available
Test Boards are Available
Attenuation: 1 dB Steps to 50 dB
50 ohm Impedance
Integral TTL Driver
Low DC Power Consumption
|
AD-007086-01
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
MACOM_general.png
|
Digital Attenuator 50 dB, 6-Bit, TTL Driver, DC-2.0 GHz
|
||
| 2006/04/12 | MAAD-007082-000100 | Buy | 0 | 2400 | 6 | 50 | 4.5 | 1 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAAD-007082.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
IP1dB: 24, LSB: 1.0
Vc: 5.0
RoHS* Compliant Version of AT90-0106
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free CSP-1 Package
Tape and Reel Packaging Available
Test Boards are Available
50 ohm Impedance
Integral TTL Driver
Attenuation: 1 dB Steps to 50 dB
Small Footprint, JEDEC Package
Low DC Power Consumption
|
AD00708201
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 50 dB, 6-Bit, TTL Driver, DC - 2.4 GHz
|
||
| 2006/03/18 | MAATSS0015 | Buy | 0 | 2000 | 4 | 15 | 2 | 1 | 50 |
SOIC16
|
MAATSS0015_SPAR.zip
|
Plastic Surface Mount
|
Yes
|
MAATSS0015.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
1-dB Attenuation Steps to 15 dB
RoHS* Compliant Version of AT-210
260°C Re-flow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOIC-16 Package
Temperature Stability +/-0.15 dB: -40°C to +85°C
Tape and Reel Packaging Available
Low DC Power Consumption: 50 µW
Low Intermodulation Product: +50 dBm IP3
High Accuracy
|
soic-16.jpg
|
Digital Attenuator, 15 dB, 4-Bit DC - 2.0 GHz
|
|||
| 2006/03/03 | MAATSS0022 | Buy | 500 | 2500 | 5 | 15.5 | 1.8 | 0.5 | 46 |
MSOP-10
|
Plastic Surface Mount
|
Yes
|
MAATSS0022.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
5 Bits, 0.5 dB Steps
RoHS* Compliant
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free MSOP-10 Package
Excellent Accuracy
Single Positive Control (+3 V to +5 V)
|
msop-10.jpg
|
Digital Attenuator, 5-Bit, 15.5 dB 500 - 2500 MHz
|
||||
| 2006/01/27 | MAATCC0011 | Buy | 0 | 4000 | 6 | 31.5 | 5.1 | 0.5 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAATCC0011.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 0.5 dB Steps to 31.5 dB
RoHS* Compliant Version of AT90-1107
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free CSP-1 Package
50 ohm Impedance
Integral TTL Driver
Small Footprint, JEDEC Package
Low DC Power Consumption
Contains internal DC to DC converter
Single Positive Supply
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 31.5 dB, 6-Bit, TTL Driver, DC-4.0 GHz
|
||||
| 2005/12/10 | AT-357-SMA | Buy | 0 | 2000 | 5 | 31 | 6.5 | 1 | 47 |
C-46
|
Connectorized
|
No
|
AT-357-SMA.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components |
No
|
Attenuation 1 dB Steps to 31 dB
Hermetic Connectorized Housing
TTL Control Interface
|
MACOM_general.png
|
GaAs Digital Attenuator 31 dB, 5 - Bit, DC - 2 GHz
|
||||
| 2005/11/13 | MAATCC0009 | Buy | 0 | 4000 | 6 | 31.5 | 3.4 | 0.5 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAATCC0009.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
IP1dB: 24, Vc: 5.0?
LSB: 0.5
RoHS* Compliant Version of AT90-0107
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free CSP-1 Package
Tape and Reel Packaging Available
Attenuation: 0.5 dB Steps to 31.5 dB
Test Boards are Available
50 Ohm Impedance
Integral TTL Driver
Small Footprint, JEDEC Package
Low DC Power Consumption
|
MAATCC0009
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 31.5 dB, 6-Bit, TTL Driver, DC-4.0 GHz
|
||
| 2005/10/20 | MAADSS0018 | Buy | 2000 | 6000 | 5 | 15.5 | 2 | 0.5 | 42 |
3mm PQFN-16LD
|
Plastic Surface Mount
|
Yes
|
MAADSS0018.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
No
|
Integrated Logic
RoHS* Compliant
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
Lead-Free 3 mm 16-Lead PQFN Package
0.5 dB Attenuation Steps to 15.5 dB
Attenuation Accuracy: 0.3 dB + 3% @ 3.4 GHz
>42 dBm typical @ 2.0 GHz
Insertion Loss: 2.0 dB @ 3.4 GHz
Positive Single Control
|
3x3 mm-16 lead PQFN.jpg
|
Digital Attenuator, 5-Bit, Single Control 15.5 dB, 2.0 - 6.0 GHz
|
||||
| 2005/11/02 | MAATCC0007 | Buy | 0 | 2000 | 5 | 31 | 2.3 | 1 | 48 |
SOW16
|
Plastic Surface Mount
|
Yes
|
MAATCC0007.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Vc: 5.0?, IP1dB: 24
LSB: 1.0
RoHS* Compliant Version of AT65-0263
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOW-16 Package
Tape and Reel Packaging Available
Attenuation: 1.0 dB Steps to 31 dB
Test Boards are Available
50 Ohm Impedance
Integral TTL Driver
Plastic SOW, Wide Body, SMT Package
Low DC Power Consumption
|
MAATCC0007
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
SOW 16.jpg
|
Digital Attenuator 31.0 dB, 5-Bit, TTL Driver, DC-2.0 GHz
|
||
| 2005/10/08 | MAATCC0005 | Buy | 0 | 2000 | 6 | 31.5 | 3.1 | 0.5 | 48 |
SOW24
|
Plastic Surface Mount
|
Yes
|
MAATCC0005.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
IP1dB: 29, LSB: 0.5
Vc: 5.0?
RoHS* Compliant Version of AT65-0107
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOW-24 Package
Tape and Reel Packaging Available
Test Boards are Available
50 Ohm Impedance
Integral TTL Driver
Attenuation: 0.5 dB Steps to 31.5 dB
Plastic SOIC, Wide Body, SMT Package
Low DC Power Consumption
|
MAATCC0005
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
MACOM_general.png
|
Digital Attenuator 31.5 dB, 6-Bit, TTL Driver, DC-2.0 GHz Rev
|
||
| 2005/08/25 | MAATCC0008 | Buy | 0 | 3000 | 4 | 15 | 1.7 | 1 | 50 |
SOW16
|
Plastic Surface Mount
|
Yes
|
MAATCC0008.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Attenuation: 1.0 dB steps to 15 dB
RoHS* Compliant Version of AT65-0413
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOW-16 Package
Temperature Stability: ±0.18 dB from –40°C to +85°C Typ.
50 Ohm Impedance
Integral TTL Driver
Low DC Power Consumption
|
SOW 16.jpg
|
Digital Attenuator 15.0 dB, 4-Bit, TTL Driver, DC-3.0 GHz
|
||||
| 2005/08/19 | MAATSS0021 | Buy | 50 | 2000 | 5 | 15.5 | 1.5 | 0.5 | 45 |
SOIC16
|
MAATSS0021_Deembedded_Spars.zip
|
Plastic Surface Mount
|
Yes
|
MAATSS0021.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
0.5 dB Attenuation Steps to 15.5 dB
RoHS* Compliant Version of AT-280
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOIC-16 Package
Temperature Stability: +/-0.15 dB from -40°C to +85°C
Tape and Reel Packaging Available
Low Intermodulation Product: +45 dBm IP3
Ultra Low DC Power Consumption
|
soic-16.jpg
|
Digital Attenuator, 15.5 dB, 5-Bit DC - 2.0 GHz
|
|||
| 2005/08/01 | AT-232-PIN | Buy | 0 | 2000 | 4 | 30 | 2.5 | 2 | 50 |
CR-6
|
Ceramic Surface Mount
|
Yes
|
AT-232-PIN.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
Attenuation: 2 dB steps to 30 dB
RoHS* Compliant
260°C Reflow Compatible
Lead-Free CR-6 Package
50 Ohm Nominal Impedance
Fast Switching Speed, 12 ns Typical
Hermetic Surface Mount Package
Low DC Power Consumption
Temperature Stability: ± 0.18 dB from –55°C to +85°C Typical
|
CR 6.JPG
|
Digital Attenuator 30.0 dB, 4-Bit, TTL Driver, DC-2.0 GHz
|
||||
| 2005/07/24 | AT-106-PIN | Buy | 5 | 2000 | 6 | 50 | 3.2 | 1 | 46 |
CR-13
|
Ceramic Surface Mount
|
Yes
|
AT-106-PIN.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Vc: 3.5
LSB: 1
RoHS* Compliant
260°C Reflow Compatible
Lead-Free CR-13 Package
50 Ohm Nominal Impedance
Integral TTL Driver
Hermetic Surface Mount Package
Low DC Power Consumption
Attenuation: 1 dB steps to 50 dB
Temperature Stability: ± 0.18 dB from –55°C to +85°C Typical
|
AT-106
|
Electrolytic gold over nickel
|
CR13.jpg
|
Digital Attenuator 50.0 dB, 6-Bit, TTL Driver, DC-2.0 GHz
|
||
| 2005/07/22 | AT-213-PIN | Buy | 5 | 3000 | 4 | 15 | 1.6 | 1 | 50 |
CR-11
|
Ceramic Surface Mount
|
Yes
|
AT-213-PIN.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
IP1dB: 28, LSB: 1.0
Vc: 3.5
260°C Reflow Compatible
Lead-Free CR-11 Package
50 Ohms Nominal Impedance
Integral TTL Driver
Attenuation: 1 dB steps to 15 dB
Hermetic Surface Mount Package
Low DC Power Consumption
Temperature Stability: ± 0.18 dB from –55°C to +85°C Typical
RoHS* Compliant
|
CR 11.JPG
|
Digital Attenuator 15.0 dB, 4-Bit, TTL Driver, DC-3.0 GHz
|
||||
| 2005/07/27 | AT-283-PIN | Buy | 5 | 2000 | 5 | 15.5 | 2.2 | 0.5 | 47 |
CR-12
|
Ceramic Surface Mount
|
Yes
|
AT-283-PIN.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
LSB: 0.5, Vc: 3.5
IP1dB: 28
RoHS* Compliant
260°C Reflow Compatible
Lead-Free CR-12 Package
50 O Nominal Impedance
Integral TTL Driver
Hermetic Surface Mount Package
Attenuation: 0.5 dB Steps to 15.5 dB
Low DC Power Consumption
Temperature Stability: ± 0.18 dB from –55°C to +85°C Typical
|
AT-283
|
Electrolytic gold over nickel
|
CR 12.JPG
|
Digital Attenuator 15.5 dB, 5-Bit, TTL Driver, DC-2.0 GHz Rev
|
||
| 2005/07/23 | AT-107-PIN | Buy | 5 | 2000 | 6 | 31.5 | 2.6 | 0.5 | 48 |
CR-13
|
Ceramic Surface Mount
|
Yes
|
AT-107-PIN.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
LSB: 0.5, IP1dB: 29
Vc: 3.5
RoHS* Compliant
260°C Reflow Compatible
Lead-Free CR-13 Package
50 Ohm Nominal Impedance
Integral TTL Driver
Attenuation: 0.5 dB steps to 31.5 dB
Hermetic Surface Mount Package
Low DC Power Consumption
Temperature Stability: ± 0.18 dB from –55°C to +85°C Typical
|
AT-107
|
Electrolytic gold over nickel
|
CR13.jpg
|
Digital Attenuator 31.5 dB, 6-Bit, TTL Driver, DC-2.0 GHz
|
||
| 2005/07/25 | MAATCC0006 | Buy | 0 | 3000 | 4 | 30 | 2.6 | 2 | 50 |
SOIC16
|
Plastic Surface Mount
|
Yes
|
MAATCC0006.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
IP1dB: 28, Vc: 5.0?
LSB: 2.0
RoHS* Compliant Version of AT65-0233
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOIC-16 Package
Temperature Stability: ±0.18 dB from -55°C to +85°C Typ
50 Ohm Impedance
Integral TTL Driver
Attenuation: 2.0 dB steps to 30 dB
Low DC Power Consumption
|
MAATCC0006
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
soic-16.jpg
|
Digital Attenuator 30.0 dB, 4-Bit, TTL Driver, DC-3.0 GHz
|
||
| 2005/07/18 | MAADCC0006 | Inquire | 50 | 4000 | 4 | 15 | 2.5 | 1 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAADCC0006.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 1 dB Steps to 15 dB
RoHS* Compliant Version of AT90-0413
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free CSP-1 Package
Tape and Reel Packaging Available
Test Boards Available
50 Ohm Impedance
Integral TTL Driver
Small Footprint, JEDEC Package
Low DC Power Consumption
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 15.0 dB, 4-Bit, TTL Driver, DC-4.0 GHz
|
||||
| 2005/07/21 | AT-233-PIN | Buy | 5 | 2000 | 4 | 30 | 1.9 | 2 | 50 |
CR-12
|
Ceramic Surface Mount
|
Yes
|
AT-233-PIN.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
LSB: 2.0, Vc: 3.5
RoHS* Compliant
260°C Reflow Compatible
Lead-Free CR-12 Package
50 Ohm Nominal Impedance
Integral TTL Driver
Attenuation: 2 dB Steps to 30 dB
Hermetic Surface Mount Package
Low DC Power Consumption
Temperature Stability: ± 0.18 dB from –55°C to +85°C Typical
|
Electrolytic gold over nickel
|
CR 12.JPG
|
Digital Attenuator 30.0 dB, 4-Bit, TTL Driver, DC-2.0 GHz
|
|||
| 2005/07/15 | AT-273-PIN | Buy | 5 | 2000 | 2 | 32 | 1.3 | 16 | 48 |
CR-11
|
Ceramic Surface Mount
|
Yes
|
AT-273-PIN.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Vc: 3.5
RoHS* Compliant
260°C Reflow Compatible
Lead-Free CR-11 Package
Tape and Reel Packaging Available
Temperature Stability: ±0.18 dB from -55°C to +85°C Typ
50 ohm Impedance
Integral TTL Driver
Hermetic Surface Mount Package
Attenuation: 16.0 dB Steps to 32 dB
Low DC Power Consumption
|
AT-273
|
Electrolytic gold over nickel
|
CR 11.JPG
|
Digital Attenuator 32.0 dB, 2-Bit, TTL Driver, DC-2.0 GHz
|
||
| 2005/07/08 | AT-263-PIN | Buy | 5 | 2000 | 5 | 31 | 2.1 | 1 | 48 |
CR-12
|
Ceramic Surface Mount
|
Yes
|
AT-263-PIN.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
LSB: 1.0, Vc: 3.5
RoHS* Compliant
260°C Reflow Compatible
Lead-Free CR-12 Package
50 Ohm Nominal Impedance
Integral TTL Driver
Hermetic Surface Mount Package
Low DC Power Consumption
Temperature Stability: ± 0.18 dB from –55°C to +85°C Typical
Attenuation: 1 dB steps to 31 dB
|
Electrolytic gold over nickel
|
CR 12.JPG
|
Digital Attenuator 31.0 dB, 5-Bit, TTL Driver, DC-2.0 GHz
|
|||
| 2005/06/24 | MAATCC0010 | Buy | 0 | 3000 | 5 | 31 | 3.6 | 1 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAATCC0010.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 1.0 dB Steps to 31 dB
RoHS* Compliant Version of AT90-0263
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free CSP-1 Package
Tape and Reel Packaging Available
Test Boards are Available
50 Ohm Impedance
Integral TTL Driver
Small Footprint, JEDEC Package
Low DC Power Consumption
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 31.0 dB, 5-Bit, TTL Driver, DC-3.0 GHz
|
||||
| 2005/04/09 | MAATSS0017 | Buy | 400 | 2500 | 5 | 15.5 | 2 | 0.5 | 47 |
QSOP16
|
MAATSS0017_SPAR.zip
|
Plastic Surface Mount
|
Yes
|
MAATSS0017.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola) |
No
|
5 Bits, 0.5 dB Steps
RoHS* Compliant Version of MAATSS0001
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free QSOP-16 (SSOP-16) Package
Single Positive Control (+3 V to +5 V)
Excellent Accuracy
|
AT-0017
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
QSOP-16.jpg
|
Digital Attenuator, 5-Bit, 15.5 dB 400 - 2500 MHz
|
|
| 2005/03/01 | MAADSS0008 | Buy | 50 | 2000 | 1 | 15 | 1 | 15 | 50 |
SOT-25
|
Plastic Surface Mount
|
Yes
|
MAADSS0008.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
IP1dB: 23
Vc: 2.5
RoHS* Compliant Version of AT-267
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOT-25 Package
Tape and Reel Packaging Available
Single 15-dB Step
2.5 to 5.0 Volt Operation
Low Loss, 0.3 dB Typical @ 900 MHz
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
SOT 25.JPG
|
Digital Attenuator, 1-Bit, 15 dB DC - 2.0 GHz
|
|||
| 2005/02/17 | MAATSS0016 | Buy | 500 | 2000 | 4 | 30 | 2.2 | 2 | 47 |
TSSOP16
|
MAATSS0016_SPAR.zip
|
Plastic Surface Mount
|
Yes
|
MAATSS0016.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
Positive Single Control
RoHS* Compliant Version of AT-264
260°C Re-flow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free TSSOP-16 Plastic Package
Low DC Power Consumption
2-dB Attenuation Steps to 30 dB
|
TSSOP-16.jpg
|
Digital Attenuator, 4-Bit, Single Control 30 dB, 0.5 - 2.0 GHz
|
Yes
|
||
| 2004/12/22 | MAATSS0018 | Buy | 100 | 2000 | 1 | 10 | 0.4 | 10 | 50 |
SOT-25
|
Plastic Surface Mount
|
Yes
|
MAATSS0018.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
Vc: 3.0
IP1dB: 28
RoHS* Compliant Version of AT-266
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOT-25 Package
Single 10 dB Step
Low Loss: 0.3 dB @ 900 MHz
|
54
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
SOT 25.JPG
|
Digital Attenuator, 1-Bit, 10 dB Step DC - 2.0 GHz
|
||
| 2000/08/17 | MADA2030G | Buy | 50 | 2000 | 5 | 15.5 | 1.9 | 0.5 | 45 |
DIE
|
Die/Bumped Die
|
Yes
|
MADA2030G.pdf
|
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification M513 - Tape and Reel Packaging for Surface Mount Components M541 - Bonding, Handling, and Mounting Procedures for Chip Diode Devices |
No
|
Attenuation 0.5-dB Steps to 15.5 dB
Ultra Low DC Power Consumption
Fast Switching Speed: 3 nS Typical to 90%
Temperature Stability: ± 0.1 dB from –55°C to +85°C Typical
|
MACOM_general.png
|
5-Bit GaAs Digital Attenuator DC- 2.0 GHz
|
||||
| 2000/08/03 | AT20-0106 | Buy | 0 | 2000 | 6 | 50 | 4.6 | 1 | 46 |
CR-13
|
Ceramic Surface Mount
|
Yes
|
AT20-0106.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Attenuation: 1 dB steps to 50 dB
RoHS* Compliant
260°C Reflow Compatible
Lead-Free CR-13 Package
50 Ohm Nominal Impedance
Low Cost/High Performance
High Intercept Point
Integral TTL Driver
Surface Mount Package
Low DC Power Consumption
Temperature Stability: ± 0.18 dB from –40°C to +85°C Typical
|
CR13.jpg
|
Digital Attenuator 50.0 dB, 6-Bit, TTL Driver, DC-2.0 GHz
|
||||
| 2000/07/28 | AT20-0273 | Buy | 0 | 2000 | 2 | 32 | 1.9 | 16 | 48 |
CR-11
|
Ceramic Surface Mount
|
Yes
|
AT20-0273.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Attenuation: 16 dB steps to 32 dB • • • • • • • • •
RoHS* Compliant
260°C Reflow Compatible
Lead-Free CR-11 Package
50 Ohm Nominal Impedance
Low Cost/High Performance
Integral TTL Driver
Surface Mount Package
Low DC Power Consumption
Temperature Stability: ± 0.18 dB from –40°C to +85°C Typical
|
CR 11.JPG
|
Digital Attenuator 32.0 dB, 2-Bit, TTL Driver, DC-2.0 GHz
|
||||
| 2000/07/22 | AT20-0107 | Buy | 0 | 2000 | 6 | 31.5 | 3.8 | 0.5 | 48 |
CR-13
|
Ceramic Surface Mount
|
Yes
|
AT20-0107.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Attenuation: 0.5 dB Steps to 31.5 dB1
RoHS* Compliant
260°C Reflow Compatible
Lead-Free CR-13 Package
Low Cost/High Performance
High Intercept Point
Integral TTL Driver
Surface Mount Package
Low DC Power Consumption
Temperature Stability: ±0.18 dB from –40ºC to +85ºC Typ
|
CR13.jpg
|
Digital Attenuator 31.5 dB, 6-Bit, TTL Driver, DC-2.0 GHz
|
||||
| 2000/07/23 | AT20-0263 | Buy | 5 | 2000 | 5 | 31 | 2.1 | 1 | 48 |
CR-12
|
Ceramic Surface Mount
|
Yes
|
AT20-0263.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
IP1dB: 28, LSB: 1.0
Vc: 5.0
RoHS* Compliant
260°C Reflow Compatible
Lead-Free CR-12 Package
50 Ohm Nominal Impedance
Attenuation: 1 dB steps to 31 dB
Low Cost/High Performance
Integral TTL Driver
Surface Mount Package
Low DC Power Consumption
Temperature Stability: ± 0.18 dB from –40°C to +85°C Typical
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AT20-0263
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Electrolytic gold over nickel
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MACOM_general.png
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Digital Attenuator 31dB, 5-Bit, TTL Driver, DC - 2 GHz
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Yes
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| MAAD-008866 | Buy | 5 | 1000 | 6 | 31.5 | 1.6 | 0.5 | 45 |
4mm PQFN-24LD
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MAAD-008866_Sparms.zip
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Plastic Surface Mount
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Yes
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MAAD-008866.pdf
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AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
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75 Ohm Impedance
0.5-dB Attenuation Steps to 31.5 dB
RoHS* Compliant
260°C Re-flow Compatible
Halogen-Free “Green” Mold Compound
Lead-Free 4mm PQFN-24LD Plastic Package
Low DC Power Consumption
Parallel & Serial (P/S) Control with power-up state selection
Integrated TTL/CMOS Compatible Driver
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V011
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100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
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4x4_24-lead PQFN.jpg
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75 Ohm Digital Attenuator, 6-Bit, Serial / Parallel Control 31.5 dB, 0.005 - 1.0 GHz
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Yes
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| MAAD-009260-000100 | Buy | 50 | 3000 | 2 | 32 | 2.7 | 16 | 42 |
CR-12
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Ceramic Surface Mount
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Yes
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MAAD-009260.pdf
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AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
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Attenuation: Two 16 dB bits
RoHS* Compliant
260°C Reflow Compatible
50 Ohm Nominal Impedance
Integral TTL Driver
Hermetic Surface Mount Package
Low DC Power Consumption
Minimal Phase Variation over Attenuation Range
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CR 12.JPG
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Constant Phase Digital Attenuator 32 dB, 2-Bit, TTL Driver, DC-3.0 GHz Rev
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| MAAD-010305 | Inquire | 5 | 1100 | 1 | 15.1 | 0.3 | 15 | 46 |
SOT-25
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MAAD-010305 Sparms.zip
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Surface Mount
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Yes
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MAAD-010305.pdf
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AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
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Single 15-dB Step
RoHS Compliant
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
Lead-Free SOT-25 Package
Positive or Negative Voltage Control
2.5 to 5.0 Volt Operation
75 ohm Impedance
Insertion Loss: 0.3 dB @ 1.1 GHz
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81
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100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
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SOT 25.JPG
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Digital Attenuator, 1-Bit, 15 dB, 75 Ohm DC - 1.1 GHz
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| MAAD-000523 | Inquire | 700 | 6000 | 6 | 31.5 | 1.9 | 0.5 | 52 |
4mm PQFN-24LD
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MAAD-000523_SN2_spar.zip
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Plastic Surface Mount
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Yes
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MAAD-000523.pdf
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AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
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Integrated CMOS/TTL Compatible Driver
Small Relative Phase Variation per Bit
260°C Re-flow Compatible
RoHS* Compliant
Halogen-Free “Green” Mold Compound
Lead-Free 4 mm 24-Lead PQFN Package
Useable from 0.4 to 8.0 GHz
0.5-dB Attenuation Steps to 31.5 dB
Attenuation Accuracy: +/-(0.4 + 4% of attenuation setting) dB
50 dBm typical @ 2 GHz
Insertion Loss: 1.6 dB typical @ 2.1 GHz
Parallel & Serial (P/S) Control with power-up state selection
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V018
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100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
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4x4_24-lead PQFN.jpg
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Digital Attenuator, 6-Bit, Serial / Parallel Control 31.5 dB, 0.7 - 6.0 GHz
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| 2020/03/23 | MAAD-011035-DIE | Inquire | 100 | 30000 | 5 | 31 | 4 | 1 | 43 |
DIE
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Die
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No
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MAAD-011035-DIE.pdf
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no
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5-Bit Digital Attenuator, 1 dB LSB
31 dB Attenuation Range
Wide Frequency Range: 0.1 - 30 GHz
Parallel Control: Complementary Controls (per bit)
Attenuation Accuracy: typ. +/-(0.3 + 4% of Attenuation Setting) dB
2.73 x 1.38 x 0.10 mm
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Digital Attenuator Die, 5-Bit, Parallel Control 0.1 - 30 GHz, 31 dB Attenuation Range
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No
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|||||
| 2020/03/31 | MAAD-011038-DIE | Inquire | 80000 | 100000 | 3 | 7 | 5 | 1 | 38 |
DIE
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Die
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Yes
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MAAD-011038-DIE.pdf
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no
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3-Bit Digital Attenuator, 1 dB LSB
7 dB Attenuation Range
Wide Frequency Range: 80 - 100 GHz
Parallel Control: Complementary Controls (per bit)
Attenuation Accuracy: +/-(0.5 + 5 % of Attenuation Setting) dB
Die Size: 2.88 x 1.02 mm
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AlGaAs PIN MMIC Digital Attenuator Die, 3-Bit, Parallel Control, 1 dB LSB, 80 - 100 GHz, 7 dB Attenuation Range
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Yes
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