MACOM’s patented Etched Facet Technology (EFT) represents a dramatic advancement in the semiconductor laser industry by addressing the primary limitations of existing technology and processes. Our etched facet lasers provide a compelling cost and performance advantage over industry cleaved facet Fabry-Perot (FP) and Distribute-Feedback (DFB) lasers with below benefits:
- Wafer-scale facet coating, testing and characterization
- Significant reduction of processing steps
- Dramatic increase in laser yield
- Both edge and surface emitting lasers available
- Capable of making very short cavity high speed, low threshold lasers
- Low cost packaging for high data rate modules
- True monolithic integration
- Flexible material and structural design
- Laser cavity independent of crystal orientation
- Scalable manufacturing technology