MACOM’s patented Etched Facet Technology (EFT) represents a dramatic advancement in the semiconductor laser industry by addressing the primary limitations of existing technology and processes.  Our etched facet lasers provide a compelling cost and performance advantage over industry cleaved facet Fabry-Perot (FP) and Distribute-Feedback (DFB) lasers with below benefits:

  • Wafer-scale facet coating, testing and characterization
  • Significant reduction of processing steps
  • Dramatic increase in laser yield
  • Both edge and surface emitting lasers available
  • Capable of making very short cavity high speed, low threshold lasers
  • Low cost packaging for high data rate modules
  • True monolithic integration
  • Flexible material and structural design
  • Laser cavity independent of crystal orientation
  • Scalable manufacturing technology 

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