Facebook
Twitter
LinkedIn2.5G Distributed Feedback Lasers
MACOM’s Distributed Feedback (DFB) laser diodes are designed for direct modulation uncooled operation up to 2.5G. These products utilize patented Etched Facet Technology (EFT) for exceptional reliability with the below benefits:
- EFT Technology enabling high performance and product uniformity
- Non-hermetic packaging ideal for Silicon Photonics based Data Center applications
- Monolithic surface emission and beam shaping for alignment with Silicon Photonics
- No isolator required due to high back-reflection rejection
Products are RoHS compliant, designed for Telcordia GR-468 and available either as tested dies on blue tape or packaged TO-56 can.
Recent Searches
- No Recent Parts found!
Parametric Search
| topOrder | releaseDate | Part Number | Ordering | Short Description | Max Data Rate (Gbps) | Wavelength (nm) | Package Size | Package Type | Benefits | Features | Product Image | Datasheet | Temp Options |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
|
|
|
|
|
|
|
||||||
| 999 | 131D-02E-VT5TB-50x | Inquire |
TO, laser, 2.5G DFB NFF, 2mm Ball Lens (6.6mm FL), Pinout Type B
|
2.5 | 1310 |
TO-56
|
TO-56
|
Design for non-hermetic package
High reliability |
1310 nm wavelength
Edge emitting laser (EEL)
Uncooled operation, -20º to 85°C
Narrow Farfield (NFF
Direct modulation up to 2.5 Gbps
Design for Telcordia GR-468
RoHS compliant
|
Request Content |
-20º to 85º
|
||
| 999 | 131D-02E-VCT11-50x | Inquire |
Die, laser, 2.5G DFB NFF, small size, chip on tape
|
2.5 | 1310 |
265 x 250 x 100um
|
Die
|
High fiber coupling efficiency
On-wafer mapping/screening Design for non-hermetic package 100% tested over temperature |
Small size die: 265 x 250 x 100um
Design for Telcordia-GR468
RoHS compliant
Edge emitting laser (EEL)
Uncooled operation, -20 to 85°C
Direct modulation up to 2.5Gbps
Narrow beam divergence angle (NFF)
1310nm wavelength
|
Request Content |
-20º to 85º
|
||
| 999 | 2015/03/30 | 131D-02I-LCT11-07 | Inquire |
2.5G 1310nm DFB Std LD
|
2.5 | 1310 |
300 x 250 x 100
|
Die
|
Design for non-hermetic package
On-wafer mapping/screening 100% tested over temperature |
1310nm wavelength
Direct modulation up to 10Gbps
Uncooled operation
Edge emitting laser (EEL)
RoHS compliant and Design for Telcordia-GR468
|
131D-02x-Lxx11.png
|
Inquire |
-40º to 85ºC
|
| 999 | 2015/03/30 | 131D-02I-LT5MB | Inquire |
2.5G 1310nm DFB Standard (Std) TO-Can
|
2.5 | 1310 |
TO-56
|
TO-Can
|
Hermetic Package
High reliability |
1310 nm wavelength
Direct modultation up to 2.5Gbps
Uncooled operation, -40°C to 85°C operating temp range
Edge emitting laser (EEL)
RoHS compliant and Design for Telcordia GR-468
TO-56 package with lens options
|
TOCAN.png
|
Request Content |
-40º to 85ºC
|
| 999 | 2020/08/06 | MAOD-127D02xL1x0 | Inquire |
1270nm Edge Emitting Reflection Tolerant DFB Laser 2.5 Gbps
|
2.5 | 1270 |
Die
|
High fiber coupling efficiency
Design for non-hermetic package On-wafer mapping/screening 100% tested over temperature |
1270nm wavelength
Narrow beam divergence angle (NFF)
Direct modulation up to 2.5Gbps
Uncooled operation, from –40°C to 95°C
Edge emitting laser (EEL)
RoHS compliant
|
Inquire |
-40°C to 95°C
|
Products
- RF Power Amplifiers >5W
- Optical Networking ICs
- Optical Components
- Amplifiers
- Diodes
- Network Connectivity Solutions
- Crosspoints and Signal Conditioners
- Frequency Conversion
- Control Products
- Passives
- SDI Products
- Frequency Generation
- Multifunction ICs & Modules
- HDcctv Devices
- Communications Processors
