MACOM’s Distributed Feedback (DFB) laser diodes are designed for direct modulation uncooled operation up to 25G. These products utilize patented Etched Facet Technology (EFT) for exceptional reliability with the below benefits:
Products are RoHS compliant, designed for Telcordia GR-468 and available either as tested dies on blue tape or packaged TO-56 can.
releaseDate | Part Number | Ordering | Short Description | Package Size | Max Data Rate (Gbps) | Package Type | Temp Options | Wavelength (nm) | Datasheet | Compatible Parts | Benefits | Product Image | Features |
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1295-25B-Lxx11-S3 | Inquire |
25Gbps DFB distributed feedback (DFB) laser diode chips
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250 x 250 x 100 μm
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25 |
Die
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1295.56 | Inquire |
Design for non-hermetic package
On-wafer mapping/screening 100% tested over temperature |
100GBASE-LR4 wavelength at 50°C typ.
Direct modulation up to 25/28Gbps
Edge emitting laser (EEL)
RoHS compliant
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1300-25B-Lxx11-S3 | Inquire |
25Gbps DFB distributed feedback (DFB) laser diode chips
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250 x 250 x 100 μm
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25 |
Die
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1300.05 | Inquire |
Design for non-hermetic package
On-wafer mapping/screening 100% tested over temperature |
100GBASE-LR4 wavelength at 50°C typ.
Direct modulation up to 25/28Gbps
Edge emitting laser (EEL)
RoHS compliant
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1304-25B-Lxx11-S3 | Inquire |
25Gbps DFB distributed feedback (DFB) laser diode chips
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250 x 250 x 100 μm
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25 |
Die
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1304.58 | Inquire |
Design for non-hermetic package
On-wafer mapping/screening 100% tested over temperature |
100GBASE-LR4 wavelength at 50°C typ.
Direct modulation up to 25/28Gbps
Edge emitting laser (EEL)
RoHS compliant
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1309-25B-Lxx11-S3 | Inquire |
25Gbps DFB distributed feedback (DFB) laser diode chips
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250 x 250 x 100 μm
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25 |
Die
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1309.14 | Inquire |
Design for non-hermetic package
On-wafer mapping/screening 100% tested over temperature |
100GBASE-LR4 wavelength at 50°C typ.
Direct modulation up to 25/28Gbps
Edge emitting laser (EEL)
RoHS compliant
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MAOD-1xxD25G-LCT2 | Inquire |
25 Gbps DFB Edge-emitting lasers for 100G CWDM4
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200 x 250 x 70 μm
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25 |
Die
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-5º to 85ºC
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MAOD-1xxD25G-LCT2_V1A.pdf
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Design for non-hermetic package
On-wafer mapping/screening 100% tested over temperature |
CWDM wavelength
Direct modulation up to 25Gbps
wavelengths 1271 / 1291 / 1311 / 1331
Uncooled operation, -5°C to +85°C
Edge emitting laser (EEL)
RoHS compliant
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MAOD-1xxD25x-LCT3 | Inquire |
25 Gbps DFB Edge-emitting lasers for 5G Fronthaul CWDM6
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200 x 250 x 70 μm
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25 |
Die
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-40°C to 95°C
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MAOD-1xxD25I-LCT3_V1A.pdf
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Design for non-hermetic package
100% tested over temperature |
CWDM wavelengths 1270 / 1290 / 1310 / 1330 / 1350 / 1370
Direct modulation up to 25Gbps
Uncooled operation, -40°C to +95°C
Edge emitting laser (EEL)
RoHS compliant
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MAOD-1xxD25B-LCT0 | Inquire |
25 Gbps DFB Edge-emitting lasers for 5G Fronthaul MWDM12
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200 x 250 x 70 μm
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25 |
Die
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50C
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MAOD-xxxD25B-LCT0_V1A_MWDM12.pdf
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Design for non-hermetic package
On-wafer mapping/screening |
Direct modulation up to 25Gbps
12 O-band laser span
Design for Telcordia GR-468
RoHS compliant
wavelengths 1267.5 / 1274.5 /1287.5 / 1294.5 / 1307.5 / 1314.5 / 1327.5 / 1334.5 / 1347.5 / 1354.5 / 1367.5 / 1374.5
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MAOD-1xxD25B-LCT1 | Inquire |
25 Gbps DFB Edge-emitting lasers for 5G Fronthaul LWDM
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200 x 250 x 70 μm
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25 |
Die
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50C
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MAOD-xxxD25B-LCT1_V1A_LWDM12.pdf
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Design for non-hermetic package
On-wafer mapping/screening |
Direct modulation up to 25Gbps
12 O-band laser span
Design for Telcordia GR-468
RoHS compliant
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