MNS

Capacitors

MACOM's chip capacitors are used extensively in commercial and aerospace and defense applications. Our capacitors are designed for long-term reliability and repeatable performance in a variety of hybrid microwave circuit applications operating up through the Ku-band frequency. MACOM’s capacitors have the distinct advantage of higher capacitance per unit area, resulting in smaller chips for a given capacitance. 

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releaseDate Part Number Ordering Short Description Capacitance (pf) Standoff Voltage (V) Chip Style Application Notes Datasheet Features Lead-Free Outline Drawings Package Package Category Pad Types Product Image
 
 
 
2001/12/21 MA4M2020 Buy MNS Microwave Chip Capacitors
20 200 132 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Round Bonding Pad
MACOM_general.png
2000/12/26 MA4M1100 Buy MNS Microwave Chip Capacitors
100 100 199 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Round Bonding Pad
MACOM_general.png
2000/09/06 MA4M3150 Buy MNS MW Chip
150 50 359 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Square Bonding Pad
MACOM_general.png
2000/08/24 MA4M1050 Buy 1 MNS Microwave Chip Capacitors
50 100 132 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Round Bonding Pad
MACOM_general.png
2000/08/02 MA4M3030 Buy MNS Microwave Chip Capacitors
30 200 352 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Square Bonding Pad
MACOM_general.png
2000/07/26 MA4M3010 Buy MNS Microwave Chip Capacitors
10 200 350 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot) • • •
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Square Bonding Pad
MACOM_general.png
2000/07/23 MA4M3100 Buy MNS Microwave Chip Capacitors
100 50 358 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Square Bonding Pad
MACOM_general.png
2000/07/20 MA4M3050 Buy MNS Microwave Chip Capacitors
50 200 354 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Square Bonding Pad
MACOM_general.png
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