Product Detail

Die, laser, 25G DFB, 1295.56±1nm, chip on tape
The 1295-25B-LCT11-S Product is directly modulated 25Gbps DFB Distributed Feedback (DFB) laser diode chip for 100GBASE –LR4 applications. The product utilizes a patented Etched Facet Technology enabling high performance and product uniformity. Product is available as tested die.
Features
  • 100GBASE-LR4 wavelength at 50°C, 1295.56 ± 1nm
  • Design for Telcordia GR-468
  • RoHS compliant
  • Edge emitting laser (EEL)
  • Direct modulation up to 25Gbps
Benefits
  • Design for non-hermetic package
  • 100% tested over temperature
  • On-wafer mapping/screening
Applications
  • Data Center
Specifications
  • Max Data Rate: 25 Gbps
  • Wavelength: 1,295 nm
Datasheet: Request Datasheet
Part Number Package MACOM Richardson RFPD DigiKey Mouser Richardson Electronics
1295-25B-LCT11
Die, laser, 25G DFB, 1295.56±1nm, chip on tape
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