Product Detail

MACOM’s 30.0-46.0 GHz GaAs MMIC receiver has a noise figure of 3.5 dB and 18.0 dB image rejection across the band. This device is a three stage LNA followed by an image reject resistive pHEMT mixer and includes an integrated LO doubler and LO buffer amplifer. The image reject mixer eliminates the need for a bandpass filter after the LNA to remove thermal noise at the image frequency. The use of integrated LO doubler and LO buffer amplifier makes the provision of the LO easier than for fundamental mixers at these frequencies. I and Q mixer outputs are provided and an external 90 degree hybrid is required to select the desired sideband. This MMIC uses M/A-COM Tech’s GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.
  • Sub-harmonic Receiver
  • RoHS* Compliant and
  • 260°C Reflow Compatible
  • 100% Commercial-Level Visual Inspection Using Mil-Std-883 Method 2010
  • 100% On-Wafer RF, DC & Noise Figure Testing
  • +2.0 dBm LO Drive Level
  • +4.0 dBm Input Third Order Intercept (IIP3)
  • Integrated LNA, LO Doubler/Buffer, Image Reject Mixer
  • 18.0 dB Image Rejection
  • 3.5 dB Noise Figure
  • 9.0 dB Conversion Gain
  • Wireless Networking and Communication
  • Min Frequency: 30,000 MHz
  • Max Frequency: 46,000 MHz
  • Conversion Gain: 9 dB
  • Noise Figure: 3.5 dB
  • Image Rejection : 18 dBm
  • LO Input Power : 2 dBm
  • IIP3: 4 dBm
  • DIE
Package Category
  • Die
  • Yes
Part Number Package MACOM Richardson RFPD DigiKey Mouser Richardson Electronics
MMIC, DIE, RX, 30.0-46.0 GHz, IR, VR
DIE Inquire Buy

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