Attenuator Pads

MACOM's fixed attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metallized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground bonding ribbon is not required. The chips may be attached using conductive epoxy or solder preform. Gold contacts on the input and output pads make assembly, using standard bonding equipment, fast and reliable.

MAT10050 Thin Film Attenuator Pads
MAT10020 Thin Film Attenuator Pads
MAT10150 Thin Film Attenuator Pads
MAT10190 Thin Film Attenuator Pads
MAT10200 Thin Film Attenuator Pads
MAT10240 Thin Film Attenuator Pads
MAT10220 Thin Film Attenuator Pads
MAT10260 Thin Film Attenuator Pads
MAT10180 Thin Film Attenuator Pads
MAT10160 Thin Film Attenuator Pads
MAT10210 Thin Film Attenuator Pads
MAT10230 Thin Film Attenuator Pads
MAT10130 Thin Film Attenuator Pads
MAT10300 Thin Film Attenuator Pads
MAT10140 Thin Film Attenuator Pads
MAT10100 Thin Film Attenuator Pads
MAT10280 Thin Film Attenuator Pads
MAT10030 Thin Film Attenuator Pads
MAT10070 Thin Film Attenuator Pads
MAT10090 Thin Film Attenuator Pads
MAT10080 Thin Film Attenuator Pads
MAT10120 Thin Film Attenuator Pads
MAT10250 Thin Film Attenuator Pads
MAT10060 Thin Film Attenuator Pads
MAT10290 Thin Film Attenuator Pads
MAT10110 Thin Film Attenuator Pads
MAT10010 Thin Film Attenuator Pads
MAT10170 Thin Film Attenuator Pads
MAT10040 Thin Film Attenuator Pads