Heterolithic Microwave Integrated Circuit (HMIC)

Heterolithic Microwave Integrated Circuit (HMIC) is a complex technology developed at MACOM that joins two different materials, glass and silicon, into a single monolithic structure. The technology integrates the best properties of each material and therefore allows monolithic circuit solutions that reduce both size and cost. HMIC should be viewed as a companion to GaAs and Silicon MMIC technology. HMIC focuses on the use of automated batch process fabrication and testing technologies to produce resistive and reactive, lumped elements which encompass small size and low loss for high performance microwave integrated circuits. This is applied at the wafer level, to substantially reduce the size, cost and performance limitations while significantly improving the reliability and repeatability of conventional diode, active, passive, hybrid and chip-and-wire microwave circuits.