MA4SPS421

Surmount PIN Diode

This device is a Silicon-Glass PIN diode chip fabricated with MACOM's patented HMIC(TM) process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptional heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. These surmount devices are suitable for usage in moderate incident power (10W C.W.) or higher incident peak power (500W) series, shunt, or series-shunt switches. Lower parasitic inductance, 0.1 to 0.2nH, and excellent RC constant (0.45pS), make the devices ideal for higher frequency switch elements compared to their plastic device counterparts.

Product Specifications

Part Number
MA4SPS421
Description
Surmount PIN Diode
Breakdown Voltage, Minimum(V)
200
Resistance(Ohm)
6.20
Total Capacitance(pF)
0.130
Lifetime(nS)
5000
CW Power Dissipation(W)
1.8
Package
Surmount Die
Package Category
Surface Mount Die
ROHS
Yes
Min Frequency(MHz)
50
Max Frequency(MHz)
6000

Order from MACOM

MA4SPS421
Diode,Silicon-Glass,PIN,Chip
MA4SPS421 Distributors
MADP-000421-12940P
Diode,PIN,Surmout,PocketTape
MADP-000421-12940P Distributors