Amplifier Gain Blocks

Amplifier Gain Blocks

At MACOM we design, manufacture, and support a wide portfolio of Amplifier Gain Blocks for RF, microwave, and millimeter wave applications. Our amplifier gain blocks cover frequencies ranging from DC to 45 GHz. MACOM’s gain blocks are used in a variety of 50 Ohm and 75 Ohm applications including; Networks, Commercial and Aerospace and Defense. Leveraging the latest innovative technology these products are available in both standard plastic packaging and bare die.

Recent Searches
Recently Viewed Products
  • No Recent Parts found!

Parametric Search

Part Number Ordering Short Description Min Frequency (MHz) Max Frequency (MHz) Gain (dB) Output P1dB (dBm) OIP3 (dBm) Bias Current (mA) Package Product Image NF (dB) 75 Ohm Package Category Rohs Lead-Free Datasheet Model Data (Sparameters) Application Notes Features Benefits Marking Lead Finish Compatible Parts Bias Voltage (V) MSL ESD Product Briefs Product Bulletins Outline Drawings Qualification Reports Brightcove Video ADS & SPICE Model Info Data Sheet Package Outline Device Firmware EVM GUI Software EVM User Guides Content Xmicrowave Image Xmicrowave URL
 
 
 
 
 
 
 
 
MAAM-011132 Inquire Driver Amplifier 17.7 - 23.6 GHz
17700 23600 23 21 33 90 4mm PQFN-16LD
4x4 mm-16 lead PQFN.jpg
No
QFN
Yes
Yes
MAAM-011132.pdf
S2083 - Surface Mounting Instructions for PQFN Packages
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
3 Stage Driver Amplifier for 18/23 GHz Bands
Variable Gain with Adjustable Bias
21 dBm Output P1dB
33 dBm Output Third Order Intercept (OIP3)
23 dB Gain
Lead-Free 4 mm 16-Lead PQFN Package
260°C Reflow Compatible
RoHS* Compliant
MAAM-011132.zip
MAAM-011101 Inquire Ultra small Broadband General Purpose Amplifier 4 - 20 GHz
4000 20000 16 19 30 45 1.5X1.2mm TDFN-6LD
1-2_x_1-5mm_6-lead.jpg
4 No
Plastic Surface Mount
Yes
Yes
MAAM-011101.pdf
MAAM-011101_sparameters_8V_25C.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Gain: 16 dB
RoHS* Compliant
Halogen-Free “Green” Mold Compound
Lead-Free 1.5 x 1.2 mm 6-Lead TDFN package
Single DC supply, +5 V to +12 V, 45 mA
+18 dBm @ 14 GHz
50 O match in and out
Flatness: ± 2 dB
260°C Reflow Compatible
45
100% matte tin plate followed by a post0plate annealing operation of 1 hr at 150C
8 3203526280001
Xmicrowave.png
http://www.xmicrowave.com/product/xm-a345-0404d/
MAAMSS0045 Inquire High Dynamic Range Low Noise Amplifier 1400 - 2000 MHz
1400 2000 14 16 29 45 SOIC8EP
soic-8.jpg
1.4 No
Plastic Surface Mount
Yes
Yes
MAAMSS0045.pdf
MAAMSS0045_Sparameters.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Low Noise Figure: 1.4 dB
RoHS* Compliant Version of AM50-0004
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOIC-8 Package
Single Supply: +3 to +8 VDC
High Gain: 14 dB
+8 dBm at 3 V, 20 mA bias
High Input IP3: +18 dBm at 8 V, 45 mA bias
260°C Reflow Compatible
Adjustable current: 20 to 60 mA with external resistor
5
MAAM02350-A2 Buy Wide Band GaAs MMIC Amplifier 0.2 - 3.0 GHz
200 3000 18 14 24 65 CR-3
MACOM_general.png
4 No
Ceramic Surface Mount
Yes
Yes
MAAM02350-A2.pdf
MAAM02350spar.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
High Gain: 18 dB
RoHS* Compliant
Lead-Free 8-lead Ceramic Package
Gain Flatness: ± 0.75 dB
Single Supply: +6 V
Noise Figure: 4 dB
Output Power: +14 dBm
260°C Reflow Compatible
Lead frame, base plate and external metallization: gold plate .000050 to .000225 thick per MIL-G-45204, type III, grade A. over electrolytic nickel plate .000075 to .000225 thick per QQ-N-290.
6
MAAM28000 Buy Wide Band GaAs MMIC Amplifier 2.0 - 8.0 GHz
2000 8000 17 14 24 60 DIE
MACOM_general.png
4.5 No
Die/Bumped Die
Yes
Yes
MAAM28000.pdf
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
18 dB Typical Gain
DC Decoupled RF Input and Output
Single Bias Supply: +10 V
± 0.5 dB Typical Broadband Gain Flatness
28000
10
MAAM28000-A1G Buy Wide Band GaAs MMIC
2000 8000 17 14 24 70 CR-10
MACOM_general.png
5.5 No
Ceramic Surface Mount
Yes
Yes
MAAM28000-A1.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Gain: 17 dB (Typ.)
260°C Reflow Compatible
RoHS* Compliant
Lead-Free 8-Lead Ceramic Package
DC Decoupled RF Input and Output
No External Components Required
Single Supply: +10 V
Broadband Gain Flatness: ± 0.5 dB (Typ.)
gold plate .000050 to .000225 thick per MIL-G-45204, type III, grade A. over electrolytic nickel plate .000075 to .000225 thick per QQ-N-290.
10
MAAM28000-A1 Buy Wide Band GaAs MMIC Amplifier 2.0 - 8.0 GHz
2000 8000 17 14 24 70 CR-3
MACOM_general.png
5.5 No
Ceramic Surface Mount
Yes
Yes
MAAM28000-A1.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Gain: 17 dB Typical
RoHS* Compliant
Lead-Free 8-Lead Ceramic Package
DC Decoupled RF Input and Output
No External Components Required
Broadband Gain Flatness: ± 0.5 dB (Typ.)
260°C Reflow Compatible
Single Supply: +10 V
AM28000-A1
Lead frame, base plate and external metallization: gold plate .000050 to .000225 thick per MIL-G-45204, type III, grade A. over electrolytic nickel plate .000075 to .000225 thick per QQ-N-290.
10
MAAM02350 Buy Wide Band GaAs MMIC Amplifier 0.2 - 3.0 GHz
200 3000 17 14 24 65 DIE
MACOM_general.png
3.7 No
Die/Bumped Die
Yes
Yes
MAAM02350.pdf
MAAM02350.zip
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
High Gain: 19 dB (Typ.)
RoHS* Compliant
Noise Figure: 3.7 dB (Typ.)
Output Power: +14 dBm (Typ.)
6
XB1004-BD Inquire Buffer Amplifier 16.0-30.0 GHz
16000 30000 21 19 29 100 DIE
MACOM_general.png
2.2 No
Die/Bumped Die
Yes
Yes
XB1004-BD-MACOMTech.pdf
xb1004_sparm.zip
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
High Dynamic Range
RoHS* Compliant
100% Visual Inspection to MIL-STD-883 Method 2010
100% On-Wafer RF, DC and Noise Figure Testing
+19.0 dBm P1dB Compression Point at Power Bias
2.2 dB Noise Figure at Low Noise Bias
21.0 dB Small Signal Gain
Low Noise or Power Bias Configurations
Excellent LO Driver/Buffer Amplifier
260°C Reflow Compatible
4
XB1006-BD Inquire Buffer Amplifier 18.0-38.0 GHz
18000 38000 21 15 25 25 DIE
MACOM_general.png
3.2 No
Die
Yes
Yes
XB1006-BD.pdf
XB1006-BD.zip
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
High Dynamic Range/Positive Gain Slope
RoHS* Compliant
100% Visual Inspection to MIL-STD-883 Method 2010
100% On-Wafer RF, DC and Noise Figure Testing
+15 dBm P1dB Compression Point at Power Bias
3.2 dB Noise Figure at Low Noise Bias
21.0 dB Small Signal Gain
Low Noise or Power Bias Configurations
Excellent LO Driver/Buffer Amplifier
260°C Reflow Compatible
4
XB1007-BD Inquire Buffer Amplifier 4.0-11.0 GHz
4000 11000 23.5 20 30 130 DIE
MACOM_general.png
4.5 No
Die/Bumped Die
Yes
Yes
XB1007-BD.pdf
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Excellent Transmit LO/Output Buffer Stage
RoHS* Compliant
100% Commercial-Level Visual Inspection Using Mil-Std-883 Method 2010
100% On-Wafer RF, DC and Output Power Testing
Variable Gain with Adjustable Bias
4.5 dB Noise Figure
23.0 dB Small Signal Gain
Compact Size
+20.0 dBm P1dB Compression Point
260°C Reflow Compatible
5
XB1005-BD Inquire Buffer Amplifier 35.0-45.0 GHz
35000 45000 23 16 26 50 DIE
MACOM_general.png
2.7 No
Die/Bumped Die
Yes
Yes
XB1005-BD.pdf
XB1005-BD.zip
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
High Dynamic Range
RoHS* Compliant
100% Commercial-Level Visual Inspection Using Mil-Std-883 Method 2010
Wafer RF, DC and Noise Figure Testing
+16 dBm P1dB Compression at Power Bias ? 100% On
2.7 dB Noise Figure at Low Noise Bias
23.0 dB Small Signal Gain
Low Noise or Power Bias Configurations
Excellent LO Driver/Buffer Amplifier
260°C Reflow Compatible
4
XB1008-BD Inquire Buffer Amplifier 10.0-21.0 GHz
10000 21000 18 20 30 130 DIE
MACOM_general.png
5.1 No
Die/Bumped Die
Yes
Yes
XB1008-BD-MACOMTech.pdf
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Excellent Transmit LO/Output Buffer Stage ? Compact Size ? 18.0 dB Small Signal Gain ? ? ? ? ? ?
RoHS* Compliant
100% Commercial-Level Visual Inspection Using Mil-Std-883 Method 2010
100% On-Wafer RF, DC & Output Power Testing
Variable Gain with Adjustable Bias
5.5 dB Noise Figure
+20.0 dBm P1dB Compression Point
260°C Reflow Compatible
4
XB1008-QT Inquire Buffer Amplifier 10.0-21.0 GHz
10000 21000 17 18 32 100 3mm PQFN-16LD
3x3_mm-16_lead_PQFN.jpg
4.5 No
Plastic Surface Mount
Yes
Yes
XB1008-QT.pdf
XB1008-QT.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Excellent Transmit LO/Output Buffer Stage
RoHS* Compliant x
100% RF, DC and Output Power Testing
Variable Gain with Adjustable Bias
4.5 dB Noise Figure
+32 dBm Output IP3
+20.0 dBm Psat
3x3mm, QFN
260°C Reflow Compatible
17.0 dB Small Signal Gain
B1008QT
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
4
MAAM-009560 Inquire RF Driver Amplifier 250 - 4000 MHz
250 4000 15 29 42 225 SOT-89
SOT-89.jpg
3 No
Plastic Surface Mount
Yes
Yes
MAAM-009560.pdf
MAAM009560_DEEMBEDDED_SPAR_S2P.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Output Intercept Point of +42 dBm over a 20 dB Input Power Range
Class 2 ESD Rating
RoHS* Compliant
Halogen-Free “Green” Mold Compound
Lead-Free SOT-89 Package
Broadband Operation
260°C Reflow Compatible
34
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
5
XB1007-QT Inquire 4.0-11.0 GHz GaAs MMICBuffer Amplifier, QFNExcellent
4000 11000 23 19 31 100 3mm PQFN-16LD
3x3mm_PQFN_16-lead.jpg
5 No
Plastic Surface Mount
Yes
No
XB1007-QT.pdf
XB1007-QT.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Excellent Transmit LO/Output Buffer StagE
Variable Gain with Adjustable Bias
4.5 dB Noise Figure
+19.0 dBm P1dB Compression Point
23.0 dB Small Signal Gain
3x3mm, QFN
100% RF, DC and Output Power
B1007
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
4
XB1014-QT Inquire Buffer Amplifier 37.0 - 40.0 GHz
37000 40000 21 20 30.5 63 3mm PQFN-16LD
3x3mm_PQFN_16-lead.jpg
No
Plastic Surface Mount
Yes
No
XB1014-QT.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
21.0 dB Small Signal Gain
RoHS* Compliant
100% RF, DC and Output Power Testing
Lead-free 3 mm 16-lead PQFN Package
Variable Gain with Adjustable Bias
+30.5 dBm Output IP3
+20.0 dBm P1dB
+22.0 dBm Psat
260°C Reflow Compatible
B1014-QT
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
4
MAAM-009286 Inquire RF Driver Amplifier 250 - 4000 MHz
250 4000 15.5 27 42 155 SOT-89
SOT-89.jpg
3.5 No
Plastic Surface Mount
Yes
Yes
MAAM-009286.pdf
MAAM009286__DEEMBEDDED_SPAR_S2P.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
+42 dBm Output IP3
Broadband Operation
Lead-Free SOT-89 Package
Halogen-Free “Green” Mold Compound
RoHS* Compliant
Class 2 ESD Rating
260°C Reflow Compatible
32
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
5
CMM0511-QT Inquire 5.0-14.0 GHz GaAs MMICPackaged Driver AmplifierPage
5000 14000 20 11 22 90 3mm PQFN-16LD
3x3mm_PQFN_16-lead.jpg
7 No
Plastic Surface Mount
Yes
Yes
CMM0511-QT.pdf
CMM0511-QT.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
20 dB Gain
On-Chip ESD Protection
5-7 V, 90 mA Self Bias
Single Power Supply
3 x 3 QFN Package
11 dBm P1dB
5
XF1001-SC Inquire 10DC-6.0 GHz1.0W Packaged HFETPage
0 6000 15.5 30 46.5 300 SOT-89
SOT-89.jpg
4.5 No
Plastic Surface Mount
Yes
Yes
XF1001-SC.pdf
XF1001-SC.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
46.5 dBm OIP3 @ 5.8 GHz
SOT-89 Package
30.0 dBm P1dB
10.0 dB Gain @ 6 GHz
15.5 dB Gain @ 2 GHz
8
MAAM-010513 Inquire 40.5 - 43.5 GHz, Amplifier, Driver
40500 43500 23 23 32 400 5mm LGA-12LD
MACOM_general.png
No
Laminate Surface Mount
Yes
Yes
MAAM-010513.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Gain: 23 dB
P1dB: 23 dBm
OIP3: 32 dBm
Variable Gain with Adjustable Bias
Lead-Free 5 mm Laminate Package
RoHS* Compliant
260°C Reflow Compatible
AM010513
Electrolytic gold over nickel
4
MAAM-011112 Inquire Buffer Amplifier 20 – 37 GHz
20000 37000 24 18 30 335 3mm PQFN-16LD
3x3 mm-16 lead PQFN.jpg
6.5 No
Plastic Surface Mount
Yes
Yes
MAAM-011112.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Wide Bandwidth
RoHS* Compliant
Lead-Free 3 mm 16-Lead PQFN Package
+4V Bias Supply
30 dBm IP3
20 dBm Output Power
24 dB Gain
260°C Reflow Compatible
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
4
MAAM-008198-00A162 Inquire Cascadable Amplifier 10 to 1200 MHz
10 1200 13 6 18 15 TO-8
MACOM_general.png
3.5 No
Hermetic
Yes
Yes
MAAM-008198-00A162.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Low Noise: 3.5 dB (Typ.)
Low VSWR: <1.5:1 (Typ.)
Good Dynamic Range: 102.5 dB (Typ.) in 1 MHz BW
High Efficiency: 15 mA (Typ.) @ +5 Volts
5
MAAM-011206 Inquire Broadband Darlington Amplifier DC-15 GHz
0 15000 14.5 20 29 72 1.5 x 1.2 mm 6-lead TDFN Plastic Package
1.2x1.5mm_6-lead.jpg
No
DFN Plastic Package
Yes
Yes
MAAM-011206.pdf
MAAM_011206_PoB_01_VD5_RB4000_ID72mA_ds.s2p
Gain: 14.5 dB @ 5 GHz
Halogen–Free “Green” Mold Compound
Lead-Free 1.5 x 1.2 mm 6-lead TDFN Plastic Package
Adjustable Current
Single Bias Operation
Noise figure: 4 dB @ 5 GHz
Output P1dB: 20.5 dBm @ 5 GHz
RoHS* Compliant
5430190225001
Xmicrowave.png
http://www.xmicrowave.com/product/xm-a4d6-0404d/