“Silicon photonics is expected to be the most scalable optical transceiver technology available while delivering lowest cost per bit for 100G and 400G. Working in conjunction with value-added foundry partners, we're using mature photonics design and manufacturing processes to deliver state-of-the-art device performance. Coupled with co-engineered driver and receiver digital circuits, our photonic and optoelectronic chipsets will deliver optimized solutions for power, size and cost.”
Photonic Integrated Circuits (PICs) is an emerging technology that uses crystalline semiconductor wafers as the platform for the integration of active and passive photonic circuits along with electronic components on a single micro-chip. Silicon photonics is the platform of choice for scalability, low cost and functional integration. With the necessary expertise, the technology enables innovative solutions utilizing silicon optical circuits and micro-optics, while allowing the optimal integration of control electronics and system packaging.
MACOM is focused on integrated silicon microphotonics which uses fine line lithography to realize high density functionality. These technologies combine high performance low power optical devices with maximum functionality and high packing density. Silicon microphotonics, in particular, brings the benefits of high-density, low-cost and performance scalability, similar to silicon CMOS chip manufacturing.
MACOM's Dr. Richard Grzybowski will be presenting MACOM’s Laser Integrated PIC (L-PIC) platform using Self-Aligned Etch Facet Technology (SAEFT) For Data Center Networks.