All Updates

LOWELL, MA, January 26, 2026 – MACOM Technology Solutions Holdings, Inc. (“MACOM”) (NASDAQ: MTSI), a leading supplier of semiconductor products, today announced the promotions of two senior leaders within the organization to the Senior Vice President level. These promotions further strengthen and expand MACOM’s management team, with a focus on executing strategic corporate initiatives to grow and better serve its diverse customer base, as well developing advanced semiconductor technologies.

LOWELL, MA, January 22, 2026 – MACOM Technology Solutions Holdings, Inc. (“MACOM”) (Nasdaq: MTSI) plans to announce financial results for its first quarter ended January 2, 2026, before market open on Thursday, February 5, 2026. In conjunction with the release, MACOM will conduct a conference call at 8:30 a.m. Eastern Time on Thursday, February 5, 2026 hosted by Mr. Stephen G. Daly, President and Chief Executive Officer, and Mr. John F. Kober, Senior Vice President and Chief Financial Officer.

LOWELL, MA, January 12, 2026 – MACOM Technology Solutions Holdings, Inc. (“MACOM”) (NASDAQ: MTSI), a leading supplier of semiconductor products, today announced the appointment of Bryan Ingram as an independent director to MACOM’s Board to Directors (the “Board”), effective January 12, 2026.

LOWELL, MA, November 25, 2025 – MACOM Technology Solutions Holdings, Inc. (“MACOM”) (Nasdaq: MTSI), a leading supplier of semiconductor products, today announced the promotion of Robert Dennehy to Chief Operating Officer (“COO”). In this role, Mr. Dennehy will continue to oversee MACOM's global operations, manufacturing, supply chain and operational strategies as the company continues to grow and serve its diverse customer base. Mr. Dennehy’s comprehensive knowledge of the company's operations, manufacturing processes and strategic objectives positions him well to lead MACOM's operational functions and support the company's future growth.

LOWELL, MA, November 6, 2025 – MACOM Technology Solutions Holdings, Inc. (“MACOM”) (Nasdaq: MTSI), a leading supplier of semiconductor products, today announced its financial results for its fiscal fourth quarter and fiscal year ended October 3, 2025.

LOWELL, MA, November 4, 2025 – MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced that it has entered into an agreement with HRL Laboratories (“HRL”) to license and manufacture HRL’s proprietary 40nm T3L GaN-on-silicon carbide (“GaN-on-SiC”) process technology. HRL and MACOM will work collaboratively on a rapid process transfer of this proprietary semiconductor process from HRL’s facility to one of MACOM’s U.S. Trusted Foundries. Under the agreement, MACOM will have an exclusive license to manufacture products based on the T3L process.

LOWELL, MA, October 24, 2025 – MACOM Technology Solutions Holdings, Inc. (“MACOM”) (Nasdaq: MTSI) plans to announce financial results for its fourth quarter and fiscal year 2025 ended October 3, 2025, before market open on Thursday, November 6, 2025. In conjunction with the release, MACOM will conduct a conference call at 8:30 a.m. Eastern Time on Thursday, November 6, 2025, hosted by Mr. Stephen G. Daly, President and Chief Executive Officer, and Mr. John F. Kober, Senior Vice President and Chief Financial Officer.

Lowell, MA, September 23, 2025 -- MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, will showcase its latest analog connectivity solutions at Stand C3419 during the European Conference on Optical Communication (ECOC) in Copenhagen, Denmark from September 29 to October 1, 2025. 

Lowell, MA, September 18, 2025 – MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, invites attendees of European Microwave Week (EuMW) 2025 in Utrecht, Netherlands to visit Booth #D068 from September 23 to 25, 2025 and review its broad portfolio of RF, microwave and millimeter wave (mmWave) product solutions, and foundry services.

LOWELL, MA, September 11, 2025 – MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced the availability of a new chipset to overcome the distance limitations of traditional PCI Express (PCIe) and Compute Express Link (CXL) connectivity by enabling high speed, low latency communication over optical fiber. Designed to maintain signal integrity and reduce latency, the chipset consists of the MATA-38794 transimpedance amplifier (TIA) and the MALD-38795 VCSEL driver. By consolidating sideband signaling into a single fiber pair, MACOM’s solution reduces the cost and complexity of optical transceivers and cabling.