All Updates

  • Events

Space Tech Expo Europe 2025

MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, will be at the Space Tech Expo from November 18 - 20, 2025. Meet the team and learn more about MACOM's latest innovations in Breman, Germany.

  • Events

ECOC 2025

MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, will be at ECOC in Copenhagen, Denmark from September 29 - October 2, 2025. Meet the team and learn more about MACOM's latest innovations at booth #C3419.

 

  • Events

EuMW 2025

MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, will be at EuMW in Utrecht, Netherlands from September 21 - 26, 2025. Meet the team and learn more about MACOM's latest innovations.

 

  • Events

CIOE 2025

MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, will be at CIOE in Shenzhen, China from September 10 - 12, 2024. Meet the team and learn more about MACOM's latest innovations.

  • News

MACOM Completes Transfer of RTP Wafer Fab

LOWELL, MA, July 25, 2025 MACOM Technology Solutions Holdings, Inc. (“MACOM”) (Nasdaq: MTSI), a leading supplier of semiconductor products, today announced it has assumed full operational control of the wafer fabrication facility it purchased, located in Research Triangle Park, North Carolina.   

  • News

MACOM to Report Third Quarter 2025 Financial Results on August 7, 2025

LOWELL, MA, July 24, 2025 – MACOM Technology Solutions Holdings, Inc. (“MACOM”) (Nasdaq: MTSI) plans to announce financial results for its third quarter ended July 4, 2025, before market open on Thursday, August 7, 2025. In conjunction with the release, MACOM will conduct a conference call at 8:30 a.m. Eastern Time on Thursday, August 7, 2025, hosted by Mr. Stephen G. Daly, President and Chief Executive Officer, and Mr. John F. Kober, Senior Vice President and Chief Financial Officer.

  • Articles

Exploring MACOM’s GaN-on-Si LNAs: A Balanced Approach to Power Handling and Gain Recovery

Blog - GaN-on-Si LNAs (1).jpgMACOM has recently expanded its RF portfolio with the introduction of Gallium Nitride on Silicon (GaN-on-Si) Low Noise Amplifiers (LNAs) — a development that reflects ongoing efforts to enhance receiver frontend performance in demanding environments.

  • News

MACOM IMS 2025 Product Preview – Satellite Communications

Lowell, MA, June 16, 2025 -- MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, announced today new additions to its RF and optical portfolio, designed to meet the evolving needs of the SATCOM industry. These products include a high bandwidth Th-Mod optical transmitter, VPX RF over Fiber (RFoF) modules and high power amplifiers for Ka-, Ku-, X- and C-Band applications. Many of these solutions will be demonstrated in MACOM’s Booth 943 at the upcoming International Microwave Symposium (IMS) on June 17 to 19, 2025 in San Francisco, CA.

  • News

MACOM IMS 2025 Product Preview - Radar

Lowell, MA, June 12, 2025 -- MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, announced a new suite of high performance RF solutions designed to meet the demanding requirements of advanced radar systems.  Many of the solutions will be demonstrated in MACOM’s Booth 943 at the upcoming International Microwave Symposium (IMS) on June 17 to 19, 2025 in San Francisco, CA.

  • News

MACOM IMS 2025 Product Preview – Electronic Countermeasures

Lowell, MA, June 10, 2025 -- MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced availability of a wideband front end module (FEM) covering 2 to 18 GHz. Ideal for electronic countermeasures (ECM) and phased array radar applications, the miniature multi-chip ENGSD00088 Transmit/Receive Module integrates a high power 3-stage Gallium Nitride (GaN) Power Amplifier (PA), a 3-stage Gallium Arsenide (GaAs) Low Noise Amplifier (LNA) and a transmit/receive (T/R) switch with a fail-safe antenna termination, all within a compact package.