|
MASWCC0010
|
Buy
|
GaAs Absorptive, Single Supply
|
0
|
4000
|
2.3
|
38
|
40
|
|
SP4T
|
No
|
CSP-2
|
|
Yes
|
MASWCC0010.pdf
|
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AN3007 - ESD/EOS Protection for GaAs MMIC Switches
AN3008 - Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches
S2079 - Drivers for GaAs FET Switches and Digital Attenuators
AG318 - Comparison of Gallium Arsenide and Silicon PIN Diodes for High Speed Microwave Switches
|
Plastic Surface Mount
|
With
|
Operates DC - 4 GHz on Single Supply
RoHS* Compliant Version of SW90-0003
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free CSP-2 Package
Tape and Reel is Available
Test Boards are Available
50 Ohm Nominal Impedance
Low DC Power Consumption
Leadless 4 x 7 mm Chip Scale Plastic Package
ASIC TTL / CMOS Driver
|
|
|
MACOM_general.png
|
|
|
|
MASWCC0009
|
Buy
|
GaAs Absorptive
|
3
|
3000
|
1.4
|
42
|
46
|
|
SP4T
|
No
|
QSOP24
|
|
Yes
|
MASWCC0009.pdf
|
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
AN3007 - ESD/EOS Protection for GaAs MMIC Switches
AN3008 - Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches
S2079 - Drivers for GaAs FET Switches and Digital Attenuators
AG318 - Comparison of Gallium Arsenide and Silicon PIN Diodes for High Speed Microwave Switches
|
Plastic Surface Mount
|
With
|
Typical Isolation: 35 dB (2.0 GHz)
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free QSOP-24 Package
Test Boards Available
Low DC Power Consumption
50 Ohm Nominal Impedance
Integral ASIC/CMOS Driver
Typical Insertion Loss: 1.2 dB (2.0 GHz)
RoHS* Compliant Version of SW65-0440
260°C Reflow Compatible
|
MASWCC0009
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
QSOP 24.JPG
|
|
|
|
MASW-007813-000000
|
Inquire
|
GaAs
|
500
|
3000
|
0.8
|
27
|
58
|
|
SP4T
|
No
|
3mm PQFN-16LD
|
|
Yes
|
MASW-007813.pdf
|
MASW-007813_SPAR.zip
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AN3007 - ESD/EOS Protection for GaAs MMIC Switches
AN3008 - Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches
S2079 - Drivers for GaAs FET Switches and Digital Attenuators
AG318 - Comparison of Gallium Arsenide and Silicon PIN Diodes for High Speed Microwave Switches
|
Plastic Surface Mount
|
Without
|
Low Voltage Operation: 2.5 V
RoHS* Compliant
260°C Re-flow Compatible
Halogen-Free “Green” Mold Compound
Low Profile, Lead-Free 3 mm PQFN Package
0.5 micron GaAs pHEMT Process
High Isolation: 25 dB at 2 GHz
Low Harmonics: < -66 dBc at +34 dBm & 1 GHz • Low Insertion Loss: 0.7 dB at 1 GHz
|
O1
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
3x3mm PQFN 16-lead.jpg
|
|
|
|
MA4AGSW4
|
Buy
|
AlGaAs Reflective
|
50
|
50000
|
0.8
|
42
|
40
|
|
SP4T
|
No
|
DIE
|
Yes
|
Yes
|
MA4AGSW4.pdf
|
MA4AGSW4_SPAR.zip
|
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
AN3008 - Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches
S2079 - Drivers for GaAs FET Switches and Digital Attenuators
AG318 - Comparison of Gallium Arsenide and Silicon PIN Diodes for High Speed Microwave Switches
AN3021 - PIN Diodes for Microwave Switch Designs
|
Die
|
Without
|
Ultra Broad Bandwidth : 50 MHz to 50 GHz
Functional Bandwidth : 50 MHz to 70 GHz
RoHS* Compliant
260°C Reflow Compatible
Polymer Scratch Protection
Silicon Nitride Passivation
MACOM ’s unique AlGaAs Hetero-Junction Anode Technology
+10mA for Isolation State
-10mA for Low Loss State
Low Current Consumption
32 dB Isolation at 50 GHz
0.7 dB Insertion Loss
|
AGPS4T
|
|
MACOM_general.png
|
3203639713001
|
|
|
MA4SW410B-1
|
Buy
|
HMIC PIN Diode with Bias
|
2000
|
18000
|
0.8
|
48
|
40
|
|
SP4T
|
No
|
DIE
|
|
Yes
|
MA4SW410B-1.pdf
|
MA4SW410B-1_SPAR.zip
|
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
AN3008 - Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches
S2079 - Drivers for GaAs FET Switches and Digital Attenuators
AG318 - Comparison of Gallium Arsenide and Silicon PIN Diodes for High Speed Microwave Switches
AN3021 - PIN Diodes for Microwave Switch Designs
|
Die/Bumped Die
|
Without
|
Broad Bandwidth
50 nS Switching Speed
Up to +30dBm C.W. Power Handling @ +25°C
Glass Encapsulated Chip with Polymer Protective Coating
Rugged Fully Monolithic
Lower Insertion Loss and Higher Isolation than Comparable pHEMT or Discrete Component Designs ?
Usable from 50 MHz to 26.5 GHz
Specified from 50 MHz to 20 GHz
|
|
|
MACOM_general.png
|
|
|
|
MA4SW410
|
Buy
|
HMIC PIN Diode
|
50
|
26500
|
0.7
|
48
|
40
|
|
SP4T
|
No
|
DIE
|
|
Yes
|
MA4SW410.pdf
|
MA4SW410_SPAR.xls
|
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
AN3008 - Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches
S2079 - Drivers for GaAs FET Switches and Digital Attenuators
AG318 - Comparison of Gallium Arsenide and Silicon PIN Diodes for High Speed Microwave Switches
AN3021 - PIN Diodes for Microwave Switch Designs
|
Die/Bumped Die
|
Without
|
Broad Bandwidth
50 nS Switching Speed
Up to +30 dBm C.W. Power Handling @ +25°C
Glass Encapsulated Chip with Polymer Protective Coating
Rugged Fully Monolithic
Usable from 50 MHz to 26.5 GHz
Specified from 50 MHz to 20 GHz
Lower Insertion Loss and Higher Isolation than Comparable pHEMT or Discrete Component Designs ?
|
|
|
MACOM_general.png
|
|
|
|
MASW4060G
|
Buy
|
GaAs
|
0
|
4000
|
1.3
|
50
|
46
|
|
SP4T
|
No
|
DIE
|
|
Yes
|
MASW4060G.pdf
|
|
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN3007 - ESD/EOS Protection for GaAs MMIC Switches
AN3008 - Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches
M515 - Techniques to Achieve High Isolation with GaAs MMIC Switch Chips
S2079 - Drivers for GaAs FET Switches and Digital Attenuators
AG318 - Comparison of Gallium Arsenide and Silicon PIN Diodes for High Speed Microwave Switches
|
Die/Bumped Die
|
Without
|
Low Insertion Loss: 1.2 dB (Typ.)
RoHS* Compliant
Terminated Option
Ultra Low DC Power Consumption
Fast Switching Speed: 4 nS (Typ.)
|
|
|
MASW4060G.PNG
|
|
|
|
MASW-004240-13170W
|
Inquire
|
HMIC™ PIN Diode with Bias
|
10
|
24000
|
2.5
|
50
|
|
|
SP4T
|
No
|
DIE
|
Yes
|
Yes
|
MASW-004240-13170W.pdf
|
|
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN3007 - ESD/EOS Protection for GaAs MMIC Switches
AN3008 - Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches
M515 - Techniques to Achieve High Isolation with GaAs MMIC Switch Chips
S2079 - Drivers for GaAs FET Switches and Digital Attenuators
AG318 - Comparison of Gallium Arsenide and Silicon PIN Diodes for High Speed Microwave Switches
|
Die/Bumped Die
|
|
Operating Freq. 10 ± 2GHz or 24 ± 2GHz
RoHS Compliant
Polymer Scratch Protection
Fully Monolithic
Rugged, Glass Encapsulated Construction
Low Current Consumption +12 mA for On State/0V for Off Condition
No Wire Bonds Required
Integrated Bias Network
Surface Mount Device
|
|
|
MACOM_general.png
|
|
|
|
MASW-004103-1365
|
Inquire
|
HMIC Si PIN Diode
|
50
|
20000
|
0.8
|
50
|
63
|
|
SP4T
|
No
|
Surmount Die
|
Yes
|
Yes
|
MASW-004103-1365.pdf
|
MASW-004103-1365.zip
|
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M541 - Bonding, Handling, and Mounting Procedures for Chip Diode Devices
AN3008 - Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches
S2079 - Drivers for GaAs FET Switches and Digital Attenuators
AG318 - Comparison of Gallium Arsenide and Silicon PIN Diodes for High Speed Microwave Switches
|
Surface Mount Die
|
Without
|
Operates 50 MHz to 20 GHz
Solderable
Silicon Nitride Passivation
Glass Encapsulated Construction
Rugged, Fully Monolithic
Polymer Scratch Protection
RoHS Compliant Surmount Package
Low Parasitic Capacitance and Inductance
High Isolation
Low Insertion Loss
Usable up to 26 GHz
Up to +38 dBm C.W. Power Handling @ +25°C
|
|
|
MACOM_general.png
|
4487668663001
|
|
|
MASW-004102-12760
|
Inquire
|
HMIC Si PIN Diode with Bias
|
2
|
18000
|
1.5
|
50
|
40
|
|
SP4T
|
No
|
DIE
|
Yes
|
Yes
|
MASW-004102-1276.pdf
|
MASW-004102_SPAR.zip
|
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN3007 - ESD/EOS Protection for GaAs MMIC Switches
AN3008 - Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches
M515 - Techniques to Achieve High Isolation with GaAs MMIC Switch Chips
S2079 - Drivers for GaAs FET Switches and Digital Attenuators
AG318 - Comparison of Gallium Arsenide and Silicon PIN Diodes for High Speed Microwave Switches
|
Die/Bumped Die
|
Without
|
Broad Bandwidth Specified up to 18 GHz
RoHS* Compliant
260°C Reflow Compatible
Fully Monolithic
Rugged, Glass Encapsulated Construction
Low Insertion Loss / High Isolation
Integrated Bias Network
Usable up to 26 GHz
|
|
|
MACOM_general.png
|
|
|
|
MASW-005102-13600
|
Inquire
|
HMIC™ Silicon PIN Diode Switch RoHS Compliant with Integrated Bias Network
|
2000
|
18000
|
1.5
|
45
|
40
|
|
|
No
|
DIE
|
Yes
|
Yes
|
MASW-005102-13600.pdf
|
|
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M541 - Bonding, Handling, and Mounting Procedures for Chip Diode Devices
AG312 - Design with PIN Diodes
AG318 - Comparison of Gallium Arsenide and Silicon PIN Diodes for High Speed Microwave Switches
AN3022 - Establishing the Minimum Reverse Bias for a PIN Diode in a High-Power Switch
AN3008 - Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches
|
Surface Mount Die
|
|
Broad Bandwidth Specified up to 18 GHz
Fully Monolithic
Rugged, Glass Encapsulated Construction
Low Insertion Loss / High Isolation
Integrated Bias Network
Usable up to 26 GHz
|
|
|
HMIC™ Silicon PIN Diode Switch.JPG
|
|
|
|
MASW-011040
|
Inquire
|
Switch, SP4T 200 W
|
50
|
1000
|
0.3
|
51
|
|
|
|
No
|
9 mm HQFN 20-lead Package
|
Yes
|
Yes
|
MASW-011040 (1).pdf
|
|
|
HQFN
|
|
200 W CW Incident Power @ +85°C
Operates from +V DC Bias Only
Harmonics: <-70 dBc
High Isolation: >40 dB
Low Insertion Loss: <0.5 dB
Halogen-Free “Green” Mold Compound
Lead-Free 9 mm HQFN 20-lead Package
RoHS* Compliant and 260°C Reflow Compatible
|
|
|
|
5796223416001
|
|
|
MASW-008566
|
Inquire
|
GaAs HP
|
0.1
|
3000
|
0.7
|
26
|
57
|
|
SP4T
|
No
|
4mm PQFN-16LD
|
Yes
|
Yes
|
MASW-008566.pdf
|
maswss0118_masw_008566_spar.zip
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AN3007 - ESD/EOS Protection for GaAs MMIC Switches
AN3008 - Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches
S2079 - Drivers for GaAs FET Switches and Digital Attenuators
AG318 - Comparison of Gallium Arsenide and Silicon PIN Diodes for High Speed Microwave Switches
|
Plastic Surface Mount
|
Without
|
|
S035
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
4x4 mm-16 lead PQFN.jpg
|
|
|
|
MASW-004100-1193
|
Inquire
|
HMIC PIN Diode
|
50
|
26500
|
0.3
|
65
|
40
|
|
SP4T
|
No
|
DIE
|
|
Yes
|
MASW-004100-1193.pdf
|
MASW-004100_s-parameters.zip
|
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN3007 - ESD/EOS Protection for GaAs MMIC Switches
AN3008 - Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches
M515 - Techniques to Achieve High Isolation with GaAs MMIC Switch Chips
S2079 - Drivers for GaAs FET Switches and Digital Attenuators
AG318 - Comparison of Gallium Arsenide and Silicon PIN Diodes for High Speed Microwave Switches
|
Die/Bumped Die
|
With
|
Ultra Broad Bandwidth: 50MHz to 26GHz
RoHS Compliant
+33dBm Power Handling
Reliable, Fully Monolithic, Glass Encapsulated Construction
50nS Switching Speed
0.9 Insertion Loss , 34dB Isolation at 20GHz
|
|
|
MACOM_general.png
|
|
|
|
MASW-010350
|
Inquire
|
SP4T High Isolation Terminated Switch
|
10
|
4000
|
0.8
|
60
|
50
|
|
|
No
|
4mm 24-LD PQFN
|
Yes
|
Yes
|
MASW-010350.pdf
|
MASW-010350_Sparameters.zip
|
|
PQFN
|
|
High Isolation: 60 dB @ 2.1 GHz
5 States: 4 ON paths and All-Off State
Low Gate Lag for timing sensitive applications
Integral CMOS Decoder
Input IP3: 50 dBm Typical @ 2.1 GHz
Insertion Loss: 0.8 dB @ 2.1 GHz
Optional 2 Control Operation (no All-Off State)
Lead-Free 4 mm 24-Lead PQFN package
50 ? Terminated Outputs (Off-State)
RoHS* Compliant
|
|
|
Macom gen.png
|
|
|
|
MASW-011087
|
Inquire
|
AlGaAs SP4T Reflective Switch
|
14000
|
38000
|
0.9
|
32
|
43
|
30
|
|
No
|
Die
|
Yes
|
Yes
|
MASW-011087-DIE.pdf
|
|
|
Die
|
|
|
|
|
MACOM Gen.png
|
5386117099001
|
MASW_011087_Sparam.zip
|
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