Transimpedance Amplifiers - Optimized Client Side

Transimpedance Amplifiers - Communications

MACOM's optoelectronics products also includes a wide range of transimpedance amplifiers (TIA) for line and client side 10G, 40G and 100G fiber optic receivers. Our portfolio includes linear TIAs for long haul coherent receivers and limiting TIAs for shorter range NRZ based receivers. These parts feature market leading gain, noise performance and power dissipation. They are available in die form for integration with photo-detectors in an optical sub-assembly. 

Recent Searches
Recently Viewed Products
  • No Recent Parts found!

Parametric Search

releaseDate Part Number Ordering Channels (#) Pad Spacing (um) Wirebond or Flip Chip Max Availability Bandwidth ( aprox) (nA) PIN or APD Max Gain (approx) (dB/Ohms) Noise at Gain (uA RMS) Supply Current (mA @ 2.9V - 3.3V) Short Description Datasheet Features
 
 
 
 
 
 
2018/03/05 MATA-03819 Inquire 4 750 Wirebond
30 PIN
4500 1.5 265 Power/Noise Optimized
Inquire
2018/03/05 MATA-03820 Inquire 4 750 Flip Chip
30 PIN
4500 1.5 265 Power/Noise Optimized
Inquire
2018/03/05 MATA-03919 Inquire 4 750 Wirebond
30 APD
4500 1.5 265 Power/Noise Optimized
Inquire
2018/03/05 MATA-03920 Inquire 4 750 Flip Chip
30 APD
4500 1.5 365 Power/Noise Optimized
Inquire
2018/03/05 MATA-38434 Inquire 4 250 Wirebond
30 PIN
4500 1.5 265 Power/Noise Optimized
MATA-38434B.pdf
2020/04/03 MATA-05819B Inquire 1 Wirebond
35 PIN and APD
4500 1.5 71 Power/Noise Optimized
Inquire
Optimized for 26 or 53 Gbaud operation via I2C

Typical Noise ~2uA RMS

Typical 30GHz bandwidth

RSSI output for alignment and monitoring

Integrated AGC loop

Low power: 190 mW typical (at 2.9V)

Designed for 600 um PD to TIA wirebond length

I2C control with programmable I2C Device ID

Optional APD use with external supply

2020/02/20 MATA-05817 Inquire 1 Wirebond
45 PIN and APD
5400 1.59 73 Bandwidth/Gain Optimized
Inquire
Optimized for 26 or 53 Gbaud operation via I2C

Typical Noise ~2uA RMS

Typical 35GHz bandwidth

RSSI output for alignment and monitoring

Integrated AGC loop

Low power: 190 mW typical (at 2.9V)

Support for wire bonding or flip-chip applications

I2C control with programmable I2C Device address

Optional APD use with external supply

2020/04/14 MATA-05827 Inquire 1 Flip Chip
45 PIN and APD
5400 1.59 73 Bandwidth/Gain Optimized
Inquire
Optimized for 26 or 53 Gbaud operation via I2C

Typical Noise ~2uA RMS

Typical 35GHz bandwidth

RSSI output for alignment and monitoring

Integrated AGC loop

Low power: 190 mW typical (at 2.9V)

Support for wire bonding or flip-chip applications

I2C control with programmable I2C Device address

Optional APD use with external supply

MATA-38134 Inquire 4 500 Wirebond
30 PIN
4500 1.5 265 Power/Noise Optimized
Inquire
Quad 26/53GBaud PAM4/NRZ TIA

500µm anode to anode spacing

Low Power, 200mW/channel

Integrated AGC loop

RSSI for photo-alignment and monitoring

Optional reverse PD bias up to 4V typical

Supported die temperature range -40 to +95C (Single-mode application)

MATA-03821 Inquire 4 750 Wirebond
40 PIN
5400 1.59 274 Bandwidth / Gain Optimized
Inquire
Optimized for 26 or 53 Gbaud operation via I2C

750 um Anode to Anode spacing

Typical Noise < 1.6 uA RMS typical

RSSI for photo-alignment and monitoring

Low Power: 192 mW/Channel typical (@ 2.9V)

Support for Wire bonding or Flip Chip applications

Integrated AGC loop

Flexible, integrated PINK regulator enabling very large and small reverse bias voltage on PD.

Operating temperature range -5 to + 95C

MATA-03822 Inquire 4 750 Flip Chip
40 PIN
5400 1.59 274 Bandwidth / Gain Optimized
Inquire
Optimized for 26 or 53 Gbaud operation via I2C

750 um Anode to Anode spacing

Typical Noise < 1.6 uA RMS typical

RSSI for photo-alignment and monitoring

Low Power: 192 mW/Channel typical (@ 2.9V)

Support for Wire bonding or Flip Chip applications

Integrated AGC loop

Flexible, integrated PINK regulator enabling very large and small reverse bias voltage on PD.

Operating temperature range -5 to + 95C

2020/04/02 MATA-03809B Inquire 1 0 Wirebond
19 PIN and APD
4500 1.5 71 26 to 28 Gbaud Linear Transimpedance Amplifier, 53 to 56 Gbps PAM4
Inquire
Optimized for 26/28 Gbaud operation via I2C

Typical Noise ~2uA RMS

Typical 19 GHz bandwidth

RSSI output for alignment and monitoring

I2C control with programmable I2C Device ID

Optional APD use with external supply

MATA-38019 Inquire 1 750 wirebond
19 PIN
4500 159 265 Bandwidth/Gain Optimized
Inquire
Optimized for 26 /28 Gbaud operation via I2C

750 um Anode to Anode spacing

RSSI for photo-alignment and monitoring

Support for Wire bonding applications

Integrated AGC loop

Flexible, integrated PINK regulator enabling large and small reverse bias voltage on PD

Operating temperature range -5 to + 95C