Transimpedance Amplifiers - Optimized Client Side

Transimpedance Amplifiers - Communications

MACOM's optoelectronics products also includes a wide range of transimpedance amplifiers (TIA) for line and client side 10G, 40G and 100G fiber optic receivers. Our portfolio includes linear TIAs for long haul coherent receivers and limiting TIAs for shorter range NRZ based receivers. These parts feature market leading gain, noise performance and power dissipation. They are available in die form for integration with photo-detectors in an optical sub-assembly.

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topOrder	releaseDate	Part Number	Ordering	Channels (#)	Pad Spacing (um)	Wirebond or Flip Chip	Max Availability Bandwidth ( aprox) (nA)	PIN or APD	Max Gain (approx) (dB/Ohms)	Noise at Gain (uA RMS)	Supply Current (mA @ 2.9V - 3.3V)	Short Description	Datasheet	Features

999	2018/03/05	MATA-03819	Inquire	4	750	Wirebond	30	PIN	4500	1.5	265	Power/Noise Optimized	Inquire
999	2018/03/05	MATA-03820	Inquire	4	750	Flip Chip	30	PIN	4500	1.5	265	Power/Noise Optimized	Inquire
999	2018/03/05	MATA-03919	Inquire	4	750	Wirebond	30	APD	4500	1.5	265	Power/Noise Optimized	Inquire
999	2018/03/05	MATA-03920	Inquire	4	750	Flip Chip	30	APD	4500	1.5	365	Power/Noise Optimized	Inquire
999	2018/03/05	MATA-38434	Inquire	4	250	Wirebond	30	PIN	4500	1.5	265	Power/Noise Optimized	Request Content
999	2020/04/03	MATA-05819B	Inquire	1		Wirebond	35	PIN and APD	4500	1.5	71	Power/Noise Optimized	Inquire	Optimized for 26 or 53 Gbaud operation via I2C Typical Noise ~2uA RMS Typical 30GHz bandwidth RSSI output for alignment and monitoring Integrated AGC loop Low power: 190 mW typical (at 2.9V) Designed for 600 um PD to TIA wirebond length I2C control with programmable I2C Device ID Optional APD use with external supply
999	2020/02/20	MATA-05817	Inquire	1		Wirebond	45	PIN and APD	5400	1.59	73	Bandwidth/Gain Optimized	Inquire	Optimized for 26 or 53 Gbaud operation via I2C Typical Noise ~2uA RMS Typical 35GHz bandwidth RSSI output for alignment and monitoring Integrated AGC loop Low power: 190 mW typical (at 2.9V) Support for wire bonding or flip-chip applications I2C control with programmable I2C Device address Optional APD use with external supply
999	2020/04/14	MATA-05827	Inquire	1		Flip Chip	45	PIN and APD	5400	1.59	73	Bandwidth/Gain Optimized	Inquire	Optimized for 26 or 53 Gbaud operation via I2C Typical Noise ~2uA RMS Typical 35GHz bandwidth RSSI output for alignment and monitoring Integrated AGC loop Low power: 190 mW typical (at 2.9V) Support for wire bonding or flip-chip applications I2C control with programmable I2C Device address Optional APD use with external supply
999		MATA-38134	Inquire	4	500	Wirebond	30	PIN	4500	1.5	265	Power/Noise Optimized	Inquire	Quad 26/53GBaud PAM4/NRZ TIA 500µm anode to anode spacing Low Power, 200mW/channel Integrated AGC loop RSSI for photo-alignment and monitoring Optional reverse PD bias up to 4V typical Supported die temperature range -40 to +95C (Single-mode application)
999		MATA-03821	Inquire	4	750	Wirebond	40	PIN	5400	1.59	274	Bandwidth / Gain Optimized	Inquire	Optimized for 26 or 53 Gbaud operation via I2C 750 um Anode to Anode spacing Typical Noise < 1.6 uA RMS typical RSSI for photo-alignment and monitoring Low Power: 192 mW/Channel typical (@ 2.9V) Support for Wire bonding or Flip Chip applications Integrated AGC loop Flexible, integrated PINK regulator enabling very large and small reverse bias voltage on PD. Operating temperature range -5 to + 95C
999		MATA-03822	Inquire	4	750	Flip Chip	40	PIN	5400	1.59	274	Bandwidth / Gain Optimized	Inquire	Optimized for 26 or 53 Gbaud operation via I2C 750 um Anode to Anode spacing Typical Noise < 1.6 uA RMS typical RSSI for photo-alignment and monitoring Low Power: 192 mW/Channel typical (@ 2.9V) Support for Wire bonding or Flip Chip applications Integrated AGC loop Flexible, integrated PINK regulator enabling very large and small reverse bias voltage on PD. Operating temperature range -5 to + 95C
999	2020/04/02	MATA-03809B	Inquire	1	0	Wirebond	19	PIN and APD	4500	1.5	71	26 to 28 Gbaud Linear Transimpedance Amplifier, 53 to 56 Gbps PAM4	Inquire	Optimized for 26/28 Gbaud operation via I2C Typical Noise ~2uA RMS Typical 19 GHz bandwidth RSSI output for alignment and monitoring I2C control with programmable I2C Device ID Optional APD use with external supply
999		MATA-38019	Inquire	1	750	wirebond	19	PIN	4500	159	265	Bandwidth/Gain Optimized	Inquire	Optimized for 26 /28 Gbaud operation via I2C 750 um Anode to Anode spacing RSSI for photo-alignment and monitoring Support for Wire bonding applications Integrated AGC loop Flexible, integrated PINK regulator enabling large and small reverse bias voltage on PD Operating temperature range -5 to + 95C
999	2020/04/14	MATA-05829	Inquire	1		Flip Chip	45	PIN and APD	5400	1.59	73	Bandwidth/Gain Optimized	Inquire	Optimized for 26 or 53 Gbaud operation via I2C Typical Noise ~2uA RMS Typical 35GHz bandwidth RSSI output for alignment and monitoring Integrated AGC loop Low power: 190 mW typical (at 2.9V) Support for wire bonding or flip-chip applications I2C control with programmable I2C Device address Optional APD use with external supply

Transimpedance Amplifiers - Optimized Client Side

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