9115ROK-BSP-1

Binary Capacitors

MACOM’s BOO and BSP Series Capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required. These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors. By connecting the pads in parallel, the capacitance values are add tive, so many combinations are possible. The BSP-1 chip offers the same capacitance values as BOO and BSP-3, but in a slightly larger chip with a more accommodating layout for ease of bonding.

Product Specifications

Part Number
9115ROK-BSP-1
Short Description
Binary Capacitors
Chip Size
.030 x .020
PAD1(pF)
1.00
PAD2(pF)
2.00
PAD3(pF)
4.00
PAD4(pF)
8.00
Total(pF)
15.00

Features

  • High Reliability Silicon, Nitride-Oxide Dielectric
  • Long Term Reliability and Stability
  • Low Loss

Technical Resources

Datasheet


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9115ROK-BSP-1
Binary Capacitors