913R7K-BSP-3

Binary Capacitors

MACOM’s BOO and BSP Series Capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required. These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors. By connecting the pads in parallel, the capacitance values are add tive, so many combinations are possible. The BSP-1 chip offers the same capacitance values as BOO and BSP-3, but in a slightly larger chip with a more accommodating layout for ease of bonding.

Product Specifications

Part Number
913R7K-BSP-3
Short Description
Binary Capacitors
Chip Size
.015 x .015
PAD1(pF)
0.25
PAD2(pF)
0.50
PAD3(pF)
1.00
PAD4(pF)
2.00
Total(pF)
3.75

Features

  • High Reliability Silicon, Nitride-Oxide Dielectric
  • Low Loss
  • Long Term Reliability and Stability

Technical Resources

Datasheet


Order from MACOM

913R7K-BOO
Capacitor,3.7 pF +/-10%,Die
913R7K-BOO Distributors
913R7K-BSP-3
Capacitor,3.7 pF +/-10%,Die
913R7K-BSP-3 Distributors