MA4E2501L-1290

Low Barrier Si Single

The MA4E2501L-1290 SURMOUNT Diodes are Silicon Low Barrier Schottky Devices fabricated with the patented Heterolithic Microwave Integrated Circuit (HMIC™) process. HMIC™ circuits consist of Silicon pedestals which form diodes or via conductors embedded in a glass dielectric, which acts as the low dispersion, microstrip transmission medium. The combination of silicon and glass allows HMIC™ devices to have excellent loss and power dissipation characteristics in a low profile, reliable device. The Surmount Schottky devices are excellent choices for circuits requiring the small parasitics of a beam lead device coupled with the superior mechanical performance of a chip. The SURMOUNT structure employs very low resistance silicon vias to connect the Schottky contacts to the metalized mounting pads on the bottom surface of the chip. These devices are reliable, repeatable, and a lower cost performance solution to conventional devices. The multi-layer metalization employed in the fabrication of the Surmount Schottky junctions includes a platinum diffusion barrier, which permits all devices to be subjected to a 16-hour non-operating stabilization bake at 300°C. The extremely small “ 0201 ” outline allows for Surface Mount placement and multi-functional polarity orientations. The MA4E2501L-1290 SURMOUNT Low Barrier Schottky diode is recommended for use in microwave circuits through Ku band frequencies for lower power applications such as mixers, sub-harmonic mixers, detectors and limiters.

Product Specifications

Part Number
MA4E2501L-1290
Description
Low Barrier Si Single
Vf(V)
0.3300
Vb
5.00
Total Capacitance(pF)
0.120
Dynamic Resistance(ohms)
10.0
Junction Capacitance(pF)
0.120
Package Category
Surface Mount Die
Package
ODS-1290

Features

  • Extremely Low Parasitic Capacitance and Inductance
  • Available in Pocket Tape and Reel
  • Reliable, Multilayer Metalization with a Diffusion Barrier, 100% Stabilization Bake (300°C, 16 hours)
  • Rugged HMIC Construction with Polyimide Scratch Protection
  • Surface Mountable in Microwave Circuits. No Wire bonds Required
  • Extremely Small 0201 (600x300um) Footprint

Applications

  • ISM

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