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Si PIN Diode
MACOM’s MA4FCP Series consists of Silicon Flip Chip PIN
diodes fabricated with MACOM’s patented HMIC process. This
diode is fabricated on epitaxial wafers using a process
designed for repeatable electrical characteristics and
extremely low parasitics. This diode is fully passivated
with Silicon Nitride and has an additional layer of Polyimide
for scratch protection. These protective coatings prevent
damage to the junction during automated or manual handling.
This flip chip configuration is suitable for pick and place insertion.
The small 0315 outline and low 0.12 pS RC product, make the device useful for multi-throw switch and switched phase shifter circuits requiring < 40 nS switching speeds up to 18 GHz operating frequency.
Features
- Lower Series Resistance : 2.6 O
- Polyimide Scratch Protection
- Silicon Nitride Reliability Passivation
- Faster Switching Speed : 40 nS
- Lower Capacitance : 40 fF
- Designed for Automated Pick and Place Insertion •
- Rugged by Design
Applications
- ISM
Specifications
- Total Capacitance: 0.03 pF
- Total Capacitance: 0.03 pF
- CW Power Dissipation: 0.2 W
- Resistance: 2.6 Ohm
- Breakdown Voltage, Minimum: 70 V
- Min Frequency: 100 MHz
- Lifetime: 140 nS
- Thermal Resistance: 450
- Max Frequency: 30,000 MHz
Datasheet
Application Notes
- AN3009 - S-Parameter S2P File Format Guide
- AN3018 - Known Good Die Delivery Specification
- M541 - Bonding, Handling, and Mounting Procedures for Chip Diode Devices
- AG312 - Design with PIN Diodes
- AN3022 - Establishing the Minimum Reverse Bias for a PIN Diode in a High-Power Switch
- AN3008 - Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches
Package
- ODS-1269 Die
Package Category
- Surface Mount Die
| Part Number | Package | MACOM | Richardson RFPD | DigiKey | Mouser | Richardson Electronics |
|---|---|---|---|---|---|---|
|
MA4FCP300
HMIC Flip Chip PIN
|
ODS-1269 |
In Stock: 100
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