MACOM's product line of MELF, PIN diodes, encompass a comprehensive
range of electrical characteristics. The chip used in the MA4P504-1072T is manufactured using a unique, CERMACHIP, passivation process which provides for a hard glass encapsulation that protects and hermetically seals the active area of the chip. This packaged, CERMACHIP, PIN diode is ideally suited for use in applications where high RF and DC voltages are present. The chip is enclosed in a rugged, ceramic, Metal Electrode Leadless Faced (MELF), surface mount package that is full face bonded to refractory metal plugs on both the anode and cathode. The result is a low loss PIN diode with low thermal resistance due to its symmetrical thermal paths. MELF PIN diodes are designed specifically for high volume tape and reel assembly. Their user friendly design provides for extremely easy, automatic, pick and place, indexing and assembly. All solderable surfaces are tin plated and are compatible with all industry standard reflow and vapor phase soldering processes.
The MA4P504-1072T MELF packaged PIN diode is suitable for use in a series or shunt configuration where there is a high incident power present. Typical applications include switches as well as attenuators from HF through UHF frequencies.