MACOM’s broad line of packaged PIN diodes
encompass a comprehensive range of electrical
characteristics and package outlines. This diverse union
of semiconductor technology and chip packaging
gives considerable flexibility to the circuit designer. The
fast switching series of Packaged PIN Diodes utilize a
thin I-region, silicon oxide or glass passivated chip
which provides for low leakage current and low insertion
loss. With the use of in process control monitors to
regulate wafer fabrication parameters, these devices
will achieve consistent performance in control circuit
applications. The high voltage product line of Packaged
PIN Diodes employs MACOM's CERMACHIP® passivation process which provides for a hard glass encapsulation that hermetically seals and protects the active area of the chip. These packaged CERMACHIP®
PIN diodes are ideally suited for use in high power applications
where high level RF voltages are present. The diode chips are bonded into sealed ceramic packages that are designed for the most stringent electrical and environmental conditions. An extensive choice of package styles are available which may be used in a
wide variety of RF microwave circuits. The Packaged PIN Diodes series are designed to have a high inherent reliability and may be ordered screened to meet many MIL-STD requirements.