MA4P7001F-1072T

High Avg. Power SMQ

MACOM's MELF and HIPAX PIN diode series are designed for usage in switch and attenuator applications requiring high power handling and low distortion. The MELF and HIPAX PIN diodes incorporate a fully passivated PIN diode chip resulting in an extremely low reverse bias leakage current. The semiconductor technology utilized in the MELF and HIPAX families draws on MACOM’s substantial experience in PIN diode design and wafer fabrication. The result is a device which has a thick I-region and long carrier lifetime while maintaining low series resistance and capacitance values. The chips of the MELF and HIPAX PIN diodes are enclosed in a rugged ceramic package and is full face bonded to metal pins on both the anode and cathode. The result is a low loss PIN diode with low thermal resistance due to symmetrical thermal paths. The parts are offered in either magnetic or non-magnetic, HIPAX (axial leaded) or Metal Electrode Leadless Faced (MELF) surface mount packages for MRI applications. The MELF is a rectangular SMQ, package which is designed for high volume tape and reel assembly. This easy to use package design makes automatic pick and place, indexing and assembly, extremely easy. The parallel flat surfaces are suitable for most key jaw or vacuum pick-up techniques. All of the solderable surfaces are tin plated and compatible with industry standard reflow and vapor phase soldering processes. See page 7 of Application Note M538 on the MACOM's website for a typical solder reflow profile.

Product Specifications

Part Number
MA4P7001F-1072T
Short Description
High Power PIN Diodes
Breakdown Voltage, Minimum(V)
100
Resistance(Ohm)
0.90
Total Capacitance(pF)
0.700
Lifetime(nS)
5000
CW Power Dissipation(W)
10.0
Thermal Resistance(°C/W)
15.0
Package
ODS-1072
Package Category
Ceramic Surface Mount
Min Frequency(MHz)
0
Max Frequency(MHz)
1500

Features

  • High Power Handling
  • Non-Magnetic Packages Available for MRI
  • RoHS Compliant
  • Available as Chips
  • Various Package Options
  • Leadless Low Inductance MELF Packages
  • Low Theta (?) Due to Full Face Chip Bonding
  • Passivated Chip for Low Leakage Current
  • Voltage Ratings up to 1000 Volts
  • Low Loss / Low Distortion

Applications

  • Aerospace and Defense
  • ISM

Order from MACOM

MA4P7001F-1072T
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