Product Detail

PIN Diode
This device is a silicon-glass PIN diode chip fabricated with MACOM's patented HMIC™ process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. Selective backside metalization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. These packageless devices are suitable for usage in moderate incident power (10 W C.W.) or higher incident peak power (500 W) series, shunt, or series shunt switches. Small parasitic inductance, 0.35 nH, and an excellent RC time constant, 0.22 pS, make these devices ideal for switch applications where higher P1dB and IP3 values are required. These diodes can also be used in p, T, tapered resistance, and switched-pad attenuator control circuits for 50W or 75W systems.
  • Surface Mount Device
  • RoHS* Compliant and 260°C Reflow Compatible
  • Higher Average and Peak Power Handling
  • Low Parasitic Capacitance and Inductance
  • Polymer Scratch Protection
  • Silicon Nitride Passivation
  • Rugged Silicon-Glass Construction
  • No Wire Bonding Required
  • Aerospace and Defense
  • ISM
  • Total Capacitance: 0.14 pF
  • Total Capacitance: 0.14 pF
  • Min Frequency: 1 MHz
  • Resistance: 2.4 Ohm
  • CW Power Dissipation: 35 W
  • Thermal Resistance: 50 
  • Breakdown Voltage, Minimum: 275 V
  • Lifetime: 2,800 nS
  • Max Frequency: 26,000 MHz
  • ODS-1270
Package Category
  • Surface Mount Die
Part Number Package MACOM Richardson RFPD DigiKey Mouser Richardson Electronics
HMIC, Surmount, Pin
In Stock: 400
Diode, PIN, Surmount
In Stock: 6000

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