Product Detail

The MA4SW510 is a SP5T, series-shunt, broadband, PIN diode switch made with MACOM’s patented HMIC™ (Heterolithic Microwave Integrated Circuit) process. This process allows the silicon pedestals which form the series - shunt diodes and vias to be embedded into low loss, low dispersion glass. By also incorporating small spacing between circuit elements, the result is an HMIC chip with low insertion loss and high isolation at frequencies up to 26.5GHz. It is designed to be used as a moderate power, high performance switch and provide superior performance when compared to similar designs that use discrete components. The top side of the chip is protected by a polymer coating for manual or automatic handling and large gold bond pads help facilitate connection of low inductance ribbons. The gold metallization on the backside of the chip allows for attachment via 80/20, gold/tin solder or conductive silver epoxy. The MA4SW510 is a high performance switch suitable for use in multi-band ECM, radar, and instrumentation control circuits where high isolation to insertion loss ratios are required. With a standard ±5V, TTL controlled, PIN diode driver, 50nS switching speeds are achievable.
  • Broad Bandwidth
  • 50 nS Switching Speed
  • Rugged Fully Monolithic
  • Lower Insertion Loss and Higher Isolation than Comparable pHEMT/ Discrete Component Designs
  • Usable from 50 MHz to 26.5 GHz
  • Specified from 50 MHz to 20 GHz
  • Up to +30dBm C.W. Power Handling @ +25°C
  • Glass Encapsulated Chip with Polymer Protective Coating
  • Aerospace and Defense
  • ISM
  • Min Frequency: 50 MHz
  • Max Frequency: 26,500 MHz
  • Insertion Loss : 0.9 dB
  • Isolation: 38 dB
  • IIP3: 40 dBm
  • CW Incident Power: 1 W
  • DIE
Package Category
  • Die/Bumped Die
  • Yes
Contact Info
Part Number Package MACOM Richardson RFPD DigiKey Mouser Richardson Electronics
HMIC Single Pole 5 Throw Switch
DIE Inquire Buy Buy
Diode, Chip, HMIC, SP5T, Boron Nitride Back
DIE Inquire

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