MACOM's product line of MELF, PIN diodes, encompass a
comprehensive range of electrical characteristics. The
chip used in the MADP-000504-10720T is manufactured using
a unique, CERMACHIP, passivation process which
provides for a hard glass encapsulation that
protects and hermetically seals the active area of
the chip. This packaged, CERMACHIP, PIN diode
is ideally suited for use in applications where high
RF and DC voltages are present.
The chip is enclosed in a rugged, ceramic, Metal
Electrode Leadless Faced (MELF), surface mount
package that is full face bonded to refractory metal
plugs on both the anode and cathode. The result is
a low loss PIN diode with low thermal resistance
due to its symmetrical thermal paths. MELF PIN
diodes are designed specifically for high volume
tape and reel assembly. Their user friendly design
provides for extremely easy, automatic, pick and
place, indexing and assembly. All solderable
surfaces are tin plated and are compatible with all
industry standard reflow and vapor phase soldering
processes.