The MADP-011034-10720T is a surface mount PIN
diode in a non-magnetic Metal Electrode Leadless
Faced (MELF) package. The MADP-011034-10720T
is manufactured using MACOM's time proven HIPAX technology. The result is a low inductance ceramic package with no ribbons
or wires. The package utilizes a unique non-magnetic
plating process that provides for a hermetically sealed
component that has extremely low electromagnetic
permeability. Incorporated in the package is a glass
passivated CERMA chip that is full face bonded on
the cathode and anode which maximizes the surface
contact area to minimize the electrical and thermal
resistances. The chip and package have been
comprehensively characterized both electrically and
mechanically to ensure repeatable and predictable
performance.