MADP-011140
Silicon Flip Chip PIN Diode
The MADP-011140 is a silicon flip chip PIN diode fabricated using MACOM’s HMIC process which provides for repeatable electrical characteristics. This diode is fabricated on epitaxial wafers using a process designed for extremely low parasitic. The diode is fully passivated with silicon nitride to minimize leakage current. The chip also has an additional polymer layer for impact and scratch protection to prevent damage to the active area during handling. The flip chip configuration is suitable for pick and place insertion. This device can be attached with solder or conductive epoxy.
Product Specifications
- Part Number
- MADP-011140
- Description
- Silicon Flip Chip PIN Diode
- Breakdown Voltage, Minimum(V)
- 70
- Resistance(Ohm)
- 2.50
- Total Capacitance(pF)
- 0.050
- Lifetime(ns)
- 100
- CW Power Dissipation(W)
- 1.0
- Thermal Resistance(°C/W)
- 100.0
- Package
- Flip Chip
- Package Category
- Silicon
- ROHS
- Yes
- Min Frequency(MHz)
- 50
- Max Frequency(MHz)
- 18000
Features
- Low Series Resistance
- Low Capacitance
- Fast Switching Speed
- Silicon Nitride Passivation
- Polymer Scratch Protection
- Lead-Free size and type of package
- RoHS* Compliant