MADP-017015-1314

Surmount PIN Diode

This device is a silicon, glass PIN diode surmount chip fabricated with MACOM’s patented HMIC™ process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptional heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. These packageless devices are suitable for usage in moderate incident power, = 50dBm/C.W. or where the peak power is = 75dBm, pulse width is = 1µS, and duty cycle is = 0.01%. Their low parasitic inductance, 0.4 nH, and excellent RC constant, make these devices a superior choice for higher frequency switch elements when compared to their plastic package counterparts.

Product Specifications

Part Number
MADP-017015-1314
Description
Surmount PIN Diode
Breakdown Voltage, Minimum(V)
115
Resistance(Ohm)
0.70
Total Capacitance(pF)
0.320
Lifetime(nS)
1300
CW Power Dissipation(W)
5.0
Thermal Resistance(°C/W)
30.0
Package
ODS-1314 die
Package Category
Surface Mount Die
Min Frequency(MHz)
1
Max Frequency(MHz)
6000

Features

  • 0603 Outline
  • High Average and Peak Power Handling
  • Low Parasitic Capacitance and Inductance
  • Polymer Scratch Protection
  • Silicon Nitride Passivation
  • No Wirebonds Required
  • 15µm I-Region Length Devices
  • Surface Mount

Applications

  • ISM

Order from MACOM

MADP-017015-13140G
Diode,PIN,HMIC,Surmount
MADP-017015-13140G Distributors