Non- Magnetic High Power PIN Diodes
PIN diode series are designed for usage in switch and attenuator applications requiring high power handling and low distortion. These diodes incorporate a fully passivated PIN diode chip resulting in an extremely low reverse bias leakage current. The semiconductor technology utilized in the HIPAX families draws on MACOM ’s substantial experience in PIN diode design and wafer fabrication. The result is a device which has a thick I-region and long carrier lifetime while maintaining low series resistance and capacitance values. The chips of the HIPAX PIN diodes are enclosed in a rugged ceramic package and is full face bonded to metal pins on both the anode and cathode. The result is a low loss PIN diode with low thermal resistance due to symmetrical thermal paths. The parts are offered in a non-magnetic, HIPAX (axial leaded) packages for MRI applications. All of the solderable surfaces are tin plated and compatible with industry standard reflow and vapor phase soldering processes. See Application Note M538for a typical solder reflow profile.
HIPAX PIN diodes are designed for use in a wide variety of switch and attenuator applications from HF through UHF frequencies and at power levels above 1 kW, CW. The internal chip as well as each diode assembly has been comprehensively tested and characterized to ensure predictable and repeatable performance.
Designed for automated assembly. These HiPAX PIN diodes are designed for high volume tape and reel assembly. All solderable surfaces are tin plated and compatible with reflow and vapor phase soldering methods.
- Part Number
- Non- Magnetic High Power PIN Diodes
- Breakdown Voltage, Minimum(V)
- Total Capacitance(pF)
- CW Power Dissipation(W)
- Thermal Resistance(°C/W)
- Package Category
- Ceramic Coaxial Mount
- Min Frequency(MHz)
- Max Frequency(MHz)
- Non-Magnetic Package Suitable for MRI Applications
- Axial Leaded Ceramic package
- Low Rs for Low Series Loss
- High Average Incident Power Handling
- RoHS* Compliant