The MASW-003103-1364 is a Surmount™ broadband monolithic SP3T switch using series and shunt connected silicon PIN diodes. This part is
designed for use as a moderate signal, high performance switch in applications up to 20 GHz. This Surface Mount chipscale configuration is optimized for broadband performance with minimal
associated parasitics usually associated with hybrid MIC designs incorporating beam lead and PIN diodes that require chip and wire assembly.
The MASW-003103-1364 is fabricated using MACOM’s patented HMIC™ (Heterolithic Microwave Integrated Circuit) process, US Patent
5,268,310. This process allows the incorporation of silicon pedestals that form series and shunt diodes or vias by imbedding them in low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives
HMIC™ devices low loss and high isolation performance through low millimeter frequencies.
Selective backside metalization is applied producing a Surface Mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact
protection. These protective coatings prevent damage to the junction and the anode airbridge during handling and assembly.