MAT10110

Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground bonding ribbon is not required. The chips may be attached using conductive epoxy or solder preform. Gold contacts on the input and output pads make assembly, using standard bonding equipment, fast and reliable. Custom values and configuration available on request.

Product Specifications

Part Number
MAT10110
Description
Thin Film Attenuator Pads
Min Frequency(MHz)
0
Max Frequency(MHz)
20000
Attenuation(dB)
11.0
Attenuation Accuracy(dB)
0.4
Input Power Max(dBm)
33.0
Return Loss(dB)
18

Features

  • RoHS
  • Ground Wrap to Top (No ground bonding required)
  • Very Good Stability Over Temperature (TCR < 100 PPM
  • Space Saving Footprint .030” X .030” (762 X .762mm)
  • Return Loss > 16 dB 13 to 20 GHz
  • Return Loss > 18 dB DC to 12 GHz
  • Flat Response From DC to 20 GHz
  • Medium Power Handling 2W CW
  • DC to 20 GHz

Technical Resources

Datasheet


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MAT10110
Attenuator,Die,11dB
MAT10110 Distributors