MACOM attenuator chips are fabricated using our
state of the art thin film metallization and advanced photolithography
technology. All devices are available in chip form with a metalized
ground connection on the back. This ground is wrapped
around on the four corners of the chip so additional
ground bonding ribbon is not required.
The chips may be attached using conductive epoxy or
solder preform. Gold contacts on the input and output
pads make assembly, using standard bonding equipment,
fast and reliable. Custom values and configuration
available on request.