The MMP7000-127 MELF PIN diode series is manufactured using MACOM’s proprietary diode process which optimizes the anode and cathode bonding area of the diode to the adjacent heat spreading metal posts within the ceramic package. This unique geometry provides lower electrical and thermal resistance within the surface mount package to provide higher average power performance to comparable surface mount diode packages.
With lower Thermal Resistance (< 20 ºC/W), RF C.W. incident power levels of + 50 dBm and RF peak incident power levels of + 60 dBm are very achievable in higher power UHF cold switching applications.
The low series resistance (< 1.0 O), coupled with the longer minority carrier lifetime, (> 8 µS), provides better IIP3 distortion values > + 70 dBm, for SP2T Tx-Rx Switches.
These devices are hermetically sealed and are constructed with materials to meet the stringent requirements for commercial and military applications. The devices are RoHS compliant.